DS92LV090A
- Bus LVDS Signaling
- 3.2 Nanosecond Propagation Delay Max
- Chip to Chip Skew ±800ps
- Low Power CMOS Design
- High Signaling Rate Capability (Above 100 Mbps)
- 0.1V to 2.3V Common Mode Range for VID = 200mV
- ±100 mV Receiver Sensitivity
- Supports Open and Terminated Failsafe on Port Pins
- 3.3V Operation
- Glitch Free Power Up/Down (Driver & Receiver Disabled)
- Light Bus Loading (5 pF Typical) per Bus LVDS Load
- Designed for Double Termination Applications
- Balanced Output Impedance
- Product Offered in 64 Pin LQFP Package
- High Impedance Bus Pins on Power off (VCC = 0V)
- Driver Channel to Channel Skew (Same Device) 230ps Typical
- Receiver Channel to Channel Skew (Same Device) 370ps Typical
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The DS92LV090A is one in a series of Bus LVDS transceivers designed specifically for the high speed, low power proprietary backplane or cable interfaces. The device operates from a single 3.3V power supply and includes nine differential line drivers and nine receivers. To minimize bus loading, the driver outputs and receiver inputs are internally connected. The separate I/O of the logic side allows for loop back support. The device also features a flow through pin out which allows easy PCB routing for short stubs between its pins and the connector.
The driver translates 3V TTL levels (single-ended) to differential Bus LVDS (BLVDS) output levels. This allows for high speed operation, while consuming minimal power with reduced EMI. In addition, the differential signaling provides common mode noise rejection of ±1V.
The receiver threshold is less than ±100 mV over a ±1V common mode range and translates the differential Bus LVDS to standard (TTL/CMOS) levels. (See Section for more details.)
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DS92LV090A 9 Channel Bus LVDS Transceiver datasheet (Rev. D) | 2013年 5月 19日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
LQFP (PM) | 64 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
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