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LMZ31704
- Complete integrated power solution allows
small footprint, low-profile design - 10-mm × 10-mm × 4.3-mm package
- Pin compatible with LMZ31710 and LMZ31707
- Efficiencies up to 95%
- Eco-mode™ / light load efficiency (LLE)
- Wide-output voltage adjust
0.6 V to 5.5 V, with 1% reference accuracy - Supports parallel operation for higher current
- Optional split power rail allows
input voltages down to 2.95 V - Adjustable switching frequency
(200 kHz to 1.2 MHz) - Synchronizes to an external clock
- Provides 180° out-of-phase clock signal
- Adjustable slow start
- Output voltage sequencing / tracking
- Power good output
- Programmable undervoltage lockout (UVLO)
- Overcurrent and overtemperature protection
- Pre-bias output start-up
- Operating temperature range: –40°C to 85°C
- Enhanced thermal performance: 13.3°C/W
- Meets EN55022 Class B emissions
- Integrated shielded inductor
- Create a custom design using the LMZ31704 with the WEBENCH® Power Designer
The LMZ31704 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 10 × 10 × 4.3 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design. Achieves greater than 95% efficiency and excellent power dissipation capability with a thermal impedance of 13.3°C/W. The LMZ31704 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
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設計與開發
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LMZ31704EVM-003 — LMZ31704 2.95V 至 17V、4A 降壓式電源模組評估板
PMP10630 — Xilinx Kintex UltraScale XCKU040 FPGA 電源解決方案、6W 參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
B3QFN (RVQ) | 42 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點