LP3892
- Ultra Low Dropout Voltage (140 mV at 1.5A typ)
- Low Ground Pin Current
- Load Regulation of 0.04%/A
- 60 nA Typical Quiescent Current in Shutdown
- 1.5% Output Accuracy (25°C)
- TO-220, DDPAK/TO-263 and SO PowerPAD-8 Packages
- Over Temperature/Over Current Protection
- −40°C to +125°C Junction Temperature Range
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The LP3892 is a high current, fast response regulator which can maintain output voltage regulation with minimum input to output voltage drop. Fabricated on a CMOS process, the device operates from two input voltages: Vbias provides voltage to drive the gate of the N-MOS power transistor, while Vin is the input voltage which supplies power to the load. The use of an external bias rail allows the part to operate from ultra low Vin voltages. Unlike bipolar regulators, the CMOS architecture consumes extremely low quiescent current at any output load current. The use of an N-MOS power transistor results in wide bandwidth, yet minimum external capacitance is required to maintain loop stability.
The fast transient response of these devices makes them suitable for use in powering DSP, Microcontroller Core voltages and Switch Mode Power Supply post regulators. The parts are available in TO-220, DDPAK/TO-263 and SO PowerPAD-8 packages.
Dropout Voltage:140mV (typ) at 1.5A load current.
Ground Pin Current: 3 mA (typ) at full load.
Shutdown Current: 60 nA (typ) when S/D pin is low.
Precision Output Voltage: 1.5% room temperature accuracy.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | LP3892 1.5A Fast-Response Ultra Low Dropout Linear Regulators datasheet (Rev. D) | 2013年 4月 2日 |
設計與開發
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MLTLDO2EVM-037 — 適用於 DCY、DDA 和 KVU 封裝的通用 LDO 線性電壓穩壓器評估模組
MLTLDO2EVM-037 多重封裝低壓差 (LDO) 評估模組 (EVM) 可讓設計工程師評估多種常用線性穩壓器封裝的運作情形及性能，以利在自己的電路應用中使用。此 EVM 配置包含 DDA、3 針腳和 5 針腳 KVU，以及用於工程師焊接和評估其零件的 DCY 封裝板上配置。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HSOIC (DDA) | 8 | Ultra Librarian |
| TO-263 (KTT) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。