MAX3221
- RS-232 Bus-pin ESD protection exceeds ±15 kV using human body model (HBM)
- Meets or exceeds the requirements of TIA/EIA-232-F and ITU V.28 standards
- Operates with 3-V to 5.5-V VCC supply
- Operates up to 250 kbps
- One driver and one receiver
- Low standby current: 1 µA typical
- External capacitors: 4 × 0.1 µF
- Accepts 5-V logic input with 3.3-V supply
- Alternative high-speed pin-compatible device (1 Mbps)
- SNx5C3221
- Automatic power-down feature automatically disables drivers for power savings
The MAX3221 device consists of one line driver, one line receiver with dedicated enable pin, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. These devices operate at data signaling rates up to 250 kbps and a maximum of 30-V/µs driver output slew rate.
Flexible control options for power management are available when the serial port is inactive. The automatic power-down feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense a valid RS-232 signal on the receiver input, the driver output is disabled and the supply current is reduced to 1 µA. The INVALID output notifies the user if an RS-232 signal is present at the receiver input.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | MAX3221 3-V to 5.5-V RS-232 Line Driver and Receiver With ±15-kV ESD Protection datasheet (Rev. P) | PDF | HTML | 2021年 7月 19日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDM-AC-LED-COM — 具有 DALI DMX512 和電源線通訊的 AC 電源 LED 照明參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SSOP (DB) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。