SN55LBC173
- Meets EIA Standards RS-422-A, RS-423-A, RS-485, and CCITT V.11
- Designed to Operate With Pulse Durations as Short as 20 ns
- Designed for Multipoint Bus Transmission on Long Bus Lines in Noisy Environments
- Input Sensitivity...±200 mV
- Low-Power Consumption...20 mA Max
- Open-Circuit Fail-Safe Design
- Pin Compatible With SN75173 and AM26LS32
LinBiCMOS is a trademark of Texas Instruments.
The SN55LBC173 is a monolithic quadruple differential line receiver with 3-state outputs designed to meet the requirements of the EIA standards RS-422-A, RS-423-A, RS-485, and CCITT V.11. This device is optimized for balanced multipoint bus transmission at data rates up to and exceeding 10 million bits per second. The four receivers share two ORed enable inputs, one active when high, the other active when low. Each receiver features high input impedance, input hysteresis for increased noise immunity, and input sensitivity of ±200 mV over a common-mode input voltage range of 12 V to -7 V. Fail-safe design ensures that if the inputs are open circuited, the output is always high. The SN55LBC173 is designed using the Texas Instruments proprietary LinBiCMOSTM technology that provides low power consumption, high switching speeds, and robustness.
This device offers optimum performance when used with the SN55LBC172M quadruple line driver. The SN55LBC173 is available in the 16-pin CDIP (J), the 16-pin CPAK (W), or the 20-pin LCCC (FK) packages.
The SN55LBC173 is characterized over the military temperature range of -55°C to 125°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Quadruple Low-Power Differential Receiver datasheet (Rev. A) | 2000年 6月 9日 | |
* | SMD | SN55LBC173 SMD 5962-90766 | 2016年 6月 21日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CDIP (J) | 16 | Ultra Librarian |
CFP (W) | 16 | Ultra Librarian |
LCCC (FK) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點