SN65HVD08
- Operates with a 3-V to 5.5-V supply
- Consumes less than 90-mW Quiescent power
- Open-circuit, short-circuit, and idle-bus failsafe receiver
- 1/8th Unit-load (up to 256 nodes on the bus)
- Bus-pin ESD protection exceeds 16-kV HBM
- Driver output voltage slew-rate limited for optimum signal quality at 10 Mbps
- Electrically compatible with ANSI TIA/EIA-485 standard
The SN65HVD08 combines a 3-state differential line driver and differential line receiver designed for balanced data transmission and interoperation with ANSI TIA/EIA-485-A and ISO-8482E standard-compliant devices.
The wide supply voltage range and low quiescent current requirements allow the SN65HVD08s to operate from a 5-V power bus in the cable with as much as a 2-V line voltage drop. Busing power in the cable can alleviate the need for isolated power to be generated at each connection of a ground-isolated bus.
The driver differential outputs and receiver differential inputs connect internally to form a differential input/output (I/O) bus port that is designed to offer minimum loading to the bus whenever the driver is disabled or not powered. The drivers and receivers have active-high and active-low enables respectively, which can be externally connected together to function as a direction control.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SNx5HVD08 Wide Supply Range RS-485 Transceiver datasheet (Rev. E) | PDF | HTML | 2023年 3月 11日 |
EVM User's guide | RS-485 Half-Duplex EVM User's Guide (Rev. C) | PDF | HTML | 2021年 9月 1日 | |
Application note | The RS-485 Unit Load and Maximum Number of Bus Connections | 2004年 3月 15日 | ||
Application note | RS-485 for Digital Motor Control Applications | 2003年 5月 12日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
RS485-HF-DPLX-EVM — RS-485 半雙工評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (P) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。