SN65HVD82
- Bus I/O Protection
- ±16-kV HBM Protection
- ±12-kV IEC61000-4-2 Contact Discharge
- +4-kV IEC61000-4-4 Fast Transient Burst
- Industrial Temperature Range –40°C to 85°C
- Large Receiver Hysteresis (60 mV Typical) for Noise Rejection
- Low-Power Consumption
- <1-µA Standby Current
- <1-mA Quiescent Current
- Signaling Rate Optimized for 250 kbps
- Create a Custom Design Using the SN65HVD82 With the WEBENCH® Power Designer
This device has robust drivers and receivers for demanding industrial applications. The bus pins are robust to ESD events, with high levels of protection to Human-Body Model, Air-Gap Discharge, and Contact Discharge specifications.
The device combines a differential driver and a differential receiver, which operate from a single 5-V power supply. The driver differential outputs and the receiver differential inputs are connected internally to form a bus port suitable for half-duplex (two-wire bus) communication. The device features a wide common-mode voltage range making the device suitable for multi-point applications over long cable runs. The device is characterized from –40°C to 85°C.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN65HVD82 Robust RS-485 Transceiver datasheet (Rev. B) | PDF | HTML | 2017年 11月 1日 |
EVM User's guide | RS-485 Half-Duplex EVM User's Guide (Rev. C) | PDF | HTML | 2021年 9月 1日 | |
Technical article | How to calculate the power dissipation of high-speed RS-485 transceivers | PDF | HTML | 2018年 6月 14日 | |
Technical article | Get Connected: The basics of protecting RS-485 against ESD | PDF | HTML | 2015年 10月 23日 | |
Analog Design Journal | Correcting cross-wire faults in modern e-metering networks | 2013年 10月 28日 | ||
Analog Design Journal | 2Q 2013 Issue Analog Applications Journal | 2013年 4月 16日 | ||
Analog Design Journal | RS-485 failsafe biasing: Old versus new transceivers | 2013年 4月 16日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。