SN65LVDM051-Q1
- Qualified for Automotive Applications
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Low-Voltage Differential 50- Line Drivers and Receivers
- Signaling Rates up to 500 Mbps
- Bus-Terminal ESD Exceeds 12 kV
- Operates From a Single 3.3 V Supply
- Low-Voltage Differential Signaling With Typical Output Voltages of 340 mV With a 50- Load
- Valid Output With as Little as 50-mV Input Voltage Difference
- Propagation Delay Times
- Driver: 1.7 ns Typ
- Receiver: 3.7 ns Typ
- Power Dissipation at 200 MHz
- Driver: 50 mW Typical
- Receiver: 60 mW Typical
- LVTTL Input Levels Are 5 V Tolerant
- Driver Is High Impedance When Disabled or With VCC < 1.5 V
- Receiver Has Open-Circuit Fail Safe
The SN65LVDM050, and SN65LVDM051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 500 Mbps (per TIA/EIA-644 definition). These circuits are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts, except that the output current of the drivers is doubled. This modification provides a minimum differential output voltage magnitude of 247 mV across a 50- load simulating two transmission lines in parallel. This allows having data buses with more than one driver or with two line termination resistors. The receivers detect a voltage difference of 50 mV with up to 1 V of ground potential difference between a transmitter and receiver.
The intended application of these devices and signaling techniques is point-to-point and multipoint, baseband data transmission over a controlled impedance media of approximately 100 of characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables.
The SN65LVDM050Q and SN65LVDM051Q are characterized for operation from 40°C to 125°C. Additionally, Q1 suffixed parts are qualified in accordance with AEC-Q100 stress test qualification for integrated circuits.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | High-Speed Differential Line Drivers And Receivers datasheet (Rev. A) | 2008年 4月 30日 | |
Application note | An Introduction to M-LVDS and Clock and Data Distribution Applications (Rev. C) | PDF | HTML | 2023年 6月 22日 | |
Application brief | How Far, How Fast Can You Operate MLVDS? | 2018年 8月 6日 | ||
Application note | SPI-Based Data Acquisition/Monitor Using the TLC2551 Serial ADC (Rev. A) | 2001年 11月 20日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。