SN65LVDS047
- >400 Mbps (200 MHz) Signaling Rates
- Flow-Through Pinout Simplifies PCB Layout
- 300 ps Maximum Differential Skew
- Propagation Delay Times 1.8 ns (Typical)
- 3.3 V Power Supply Design
- ±350 mV Differential Signaling
- High Impedance on LVDS Outputs on Power Down
- Conforms to TIA/EIA-644 LVDS Standard
- Industrial Operating Temperature Range (–40°C to 85°C)
- Available in SOIC and TSSOP Packages
The SN65LVDS047 is a quad differential line driver that implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.
The intended application of this device and signaling technique is for point-to-point and multi-drop baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other system characteristics.
The SN65LVDS047 is characterized for operation from -40°C to 85°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LVDS Quad Differential Line Driver datasheet (Rev. B) | 2003年 12月 1日 | |
Application note | Introduction to HVDC Architecture and Solutions for Control and Protection (Rev. B) | PDF | HTML | 2021年 9月 7日 | |
Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
Technical article | Applications of Low Voltage Differential Signaling (LVDS) in Multifunction and Ind | PDF | HTML | 2017年 8月 24日 | |
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 16 | Ultra Librarian |
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。