SN65LVDS049
- DS90LV049 Compatible
- Up to 400-Mbps Signaling Rates
- Flow-Through Pinout
- 50-ps Driver Channel-to-Channel Skew (Typical)
- 50-ps Receiver Channel-to-Channel Skew
(Typical) - 3.3-V Power Supply
- High-Impedance Disable for All Outputs
- Internal Fail-safe Biasing of Receiver Inputs
- 1.4-ns Driver Propagation Delay (Typical)
- 1.9-ns Receiver Propagation Delay (Typical)
- High-Impedance Bus Pins on Power Down
- ANSI TIA/EIA-644-A Compliant
- Receiver Input and Driver Output ESD Exceeds
10 kV - 16-Pin TSSOP Package
The SN65LVDS049 device is a dual flow-through differential line driver-receiver pair that uses low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps. The driver and receiver electrical interfaces are compliant to the TIA/EIA-644-A standard.
The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100-Ω characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application specific characteristics.
The SN65LVDS049 is characterized for operation from 40°C to 85°C
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN65LVDS049 Dual-LVDS Differential Drivers and Receivers datasheet (Rev. A) | PDF | HTML | 2015年 7月 31日 |
Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。