SN65LVDT14-EP
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree
- Integrated 110- Nominal Receiver Line Termination Resistor
- Operate From a Single 3.3-V Supply
- Greater Than 125-Mbps Data Rate
- Flow-Through Pinout
- LVTTL-Compatible Logic I/Os
- ESD Protection on Bus Pins Exceeds 12 kV
- Meet or Exceed Requirements of ANSI/TIA/EIA-644A Standard for LVDS
- 20-Pin Thin Shrink Small-Outline Package (PW) With 26-Mil Terminal Pitch
- APPLICATIONS
- Memory Stick™ Interface Extensions With Long Interconnects Between Host and
Memory Stick - Serial Peripheral Interface™ (SPI™) Interface Extension to Allow Long Interconnects
Between Master and Slave - MultiMediaCard™ (MMC) Interface in SPI Mode
- General-Purpose Asymmetric Bidirectional Communication
- Memory Stick™ Interface Extensions With Long Interconnects Between Host and
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
Serial Peripheral Interface, SPI are trademarks of Motorola.
MultiMediaCard is a trademark of MultiMediaCard Association.
Memory Stick is a trademark of Sony.
The SN65LVDT14 combines one LVDS line driver with four terminated LVDS line receivers in one package. It is designed to be used at the Memory Stick end of an LVDS-based Memory Stick interface extension.
The SN65LVDT41 combines four LVDS line drivers with a single terminated LVDS line receiver in one package. It is designed to be used at the host end of an LVDS-based Memory Stick interface extension.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN65LVDT14-EP, SN65LVDT41-EP datasheet | 2005年 6月 7日 | |
* | VID | SN65LVDT14-EP VID V6205615 | 2016年 6月 21日 | |
* | VID | SN65LVDT14-EP VID V6205615 | 2016年 6月 21日 | |
Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。