SN65LVDT2
- Meets or Exceeds the ANSI TIA/EIA-644 Standard
- Designed for Signaling Rates (1) up to:
- 630Mbps for Drivers
- 400Mbps for Receivers
- Operates From a 2.4V to 3.6V Supply
- Available in SOT-23 and SOIC Packages
- Bus-Terminal ESD Exceeds 9kV
- Low-Voltage Differential Signaling With Typical Output Voltages of 350mV Into a 100Ω Load
- Propagation Delay Times
- 1.7ns Typical Driver
- 2.5ns Typical Receiver
- Power Dissipation at 200MHz
- 25mW Typical Driver
- 60mW Typical Receiver
- LVDT Receiver Includes Line Termination
- Low Voltage TTL (LVTTL) Level Driver Input Is 5V Tolerant
- Driver Is Output High-Impedance with VCC < 1.5V
- Receiver Output and Inputs are High-Impedance With VCC < 1.5V
- Receiver Open-Circuit Fail Safe
- Differential Input Voltage Threshold Less Than 100mV
(1)The signaling rate of a line, is the number of voltage transitions that are made per second expressed in the units bps (bits per second)
The SN65LVDS1, SN65LVDS2, and SN65LVDT2 devices are single, low-voltage, differential line drivers and receivers in the small-outline transistor package. The outputs comply with the TIA/EIA-644 standard and provide a minimum differential output voltage magnitude of 247mV into a 100Ω load at signaling rates up to 630Mbps for drivers and 400Mbps for receivers.
When the SN65LVDS1 device is used with an LVDS receiver (such as the SN65LVDT2) in a point-to-point connection, data or clocking signals can be transmitted over printed-circuit board traces or cables at very high rates with very low electromagnetic emissions and power consumption. The packaging, low power, low EMI, high ESD tolerance, and wide supply voltage range make the device ideal for battery-powered applications.
The SN65LVDS1, SN65LVDS2, and SN65LVDT2 devices are characterized for operation from –40°C to 85°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN65LVDxx High-Speed Differential Line Drivers and Receivers datasheet (Rev. M) | PDF | HTML | 2024年 3月 1日 |
Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
SOT-23 (DBV) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。