SN75LBC172
- Exceeds or meets EIA standard RS-485
- Designed for high-speed multipoint transmission on long bus lines in noisy environments
- Supports data rates up to and exceeding ten million transfers per second
- Provides a common-mode output voltage range of −7V to 12V
- Offers positive-and negative-current limiting
- Consumes low power to 1.5mA max (output disabled)
- Functions interchangeably with the SN75172
The SN65LBC172 and SN75LBC172 are monolithic quadruple differential line drivers with three-state outputs. Both devices are designed to meet the requirements of EIA Standard RS-485. These devices are optimized for balanced multipoint bus transmission at data rates up to and exceeding 10 million bits per second. Each driver features wide positive and negative common- mode output voltage ranges, current limiting, and thermal-shutdown circuitry which provides a party-line application in noisy environments. Both devices are designed using LinBiCMOS™, facilitating ultra-low power consumption and inherent robustness.
Both the SN65LBC172 and SN75LBC172 provide positive- and negative-current limiting and thermal shutdown for protection from line fault conditions on the transmission bus line. These devices offer optimum performance when used with the SN75LBC173 or SN75LBC175 quadruple line receivers. The SN65LBC172 and SN75LBC172 are available in the 16-pin DIP package (N) and the 20-pin wide-body small-outline inline-circuit (SOIC) package (DW).
The SN75LBC172 is characterized for operation over the commercial temperature range of 0°C to 70°C. The SN65LBC172 is characterized over the industrial temperature range of −40°C to 85°C.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN65LBC172, SN75LBC172 Quadruple Low-Power Differential Line Driver datasheet (Rev. F) | PDF | HTML | 2024年 4月 16日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
PDIP (N) | 16 | Ultra Librarian |
SOIC (DW) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點