SN75LVDS389
- Four (’391), Eight (’389), or Sixteen (’387) Line
Drivers Meet or Exceed the Requirements of ANSI
EIA/TIA-644 Standard - Designed for Signaling Rates Up to 630 Mbps
With Very Low Radiation (EMI) - Low-Voltage Differential Signaling With Typical
Output Voltage of 350 mV and a 100-Ω Load - Propagation Delay Times Less Than 2.9 ns
- Output Skew Is Less Than 150 ps
- Part-to-Part Skew Is Less Than 1.5 ns
- 35-mW Total Power Dissipation in Each Driver
Operating at 200 MHz - Driver Is High-Impedance When Disabled or With
VCC < 1.5 V - SN65’ Version Bus-Pin ESD Protection Exceeds
15 kV - Packaged in Thin Shrink Small-Outline Package
With 20-mil Pin Pitch - Low-Voltage TTL (LVTTL) Logic Inputs Are 5-V
Tolerant
This family of 4, 8, and 16 differential line drivers implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the 16 current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.
When disabled, the driver outputs are high-impedance. Each driver input (A) and enable (EN) have an internal pulldown that will drive the input to a low level when open-circuited.
The SN65LVDS387, SN65LVDS389, and SN65LVDS391 devices are characterized for operation from –40°C to 85°C. The SN75LVDS387, SN75LVDS389, and SN75LVDS391 devices are characterized for operation from 0°C to 70°C.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | SNx5LVDS3xx High-Speed Differential Line Drivers datasheet (Rev. G) | PDF | HTML | 2016年 1月 14日 |
| Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
| Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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SN65LVDS387EVM — 16 通道 LVDS 驅動器評估模組
We have designed easy-to-use evaluation modules (EVM) for our 16-channel low-voltage differential signaling (LVDS) driver and receivers. Flexibility has been designed into these EVMs so they can be set up in a point-to-point topology (1 driver to 1 receiver) or a multidrop topology (1 driver (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (DBT) | 38 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。