TLV700
- Very Low Dropout:
- 43 mV at IOUT = 50 mA, VOUT = 2.8 V
- 85 mV at IOUT = 100 mA, VOUT = 2.8 V
- 175 mV at IOUT = 200 mA, VOUT = 2.35 V
- 2% Accuracy
- Low IQ: 31 µA
- Available in Fixed-Output Voltages from 1.2 V to
4.8 V - High PSRR: 68 dB at 1 kHz
- Stable With Effective Capacitance of 0.1 µF(1)
- Thermal Shutdown and Overcurrent Protection
- Available in 1.5-mm × 1.5-mm SON-6, SOT23-5,
and SC-70 Packages
The TLV700 series of low-dropout (LDO) linear regulators are low quiescent current devices with excellent line and load transient performance. These LDOs are designed for power-sensitive applications. A precision bandgap and error amplifier provides overall 2% accuracy. Low output noise, very high power-supply rejection ratio (PSRR), and low dropout voltage make this series of devices ideal for most battery-operated handheld equipment. All device versions have thermal shutdown and current limit for safety.
Furthermore, these devices are stable with an effective output capacitance of only 0.1 µF. This feature enables the use of cost-effective capacitors that have higher bias voltages and temperature derating. The devices regulate to specified accuracy with no output load.
The TLV700 series of LDOs are available in 1.5-mm × 1.5-mm SON-6, SOT-5, and SC70 packages.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TLV700 200-mA, Low-IQ, Low-Dropout Regulator for Portable Devices datasheet (Rev. E) | PDF | HTML | 2014年 9月 17日 |
| Application note | A Topical Index of TI LDO Application Notes (Rev. F) | 2019年 6月 27日 | ||
| More literature | Device Topside Marking Information: TLV700xx | 2010年 3月 3日 | ||
| EVM User's guide | Using the TLV700xxEVM-463 | 2009年 10月 30日 | ||
| EVM User's guide | Using the TLV700xxEVM-503 | 2009年 10月 30日 |
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOT-23-THN (DDC) | 5 | Ultra Librarian |
| SOT-SC70 (DCK) | 5 | Ultra Librarian |
| WSON (DSE) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。