TLV9001
- Scalable CMOS amplifier for low-cost applications
- Rail-to-rail input and output
- Low input offset voltage: ±0.4 mV
- Unity-gain bandwidth: 1 MHz
- Low broadband noise: 27 nV/√Hz
- Low input bias current: 5 pA
- Low quiescent current: 60 µA/Ch
- Unity-gain stable
- Internal RFI and EMI filter
- Operational at supply voltages as low as 1.8 V
- Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
- Extended temperature range: –40°C to 125°C
The TLV900x family includes single (TLV9001), dual (TLV9002), and quad-channel (TLV9004) low-voltage (1.8 V to 5.5 V) operational amplifiers (op amps) with rail-to-rail input and output swing capabilities. These op amps provide a cost-effective solution for space-constrained applications such as smoke detectors, wearable electronics, and small appliances where low-voltage operation and high capacitive-load drive are required. The capacitive-load drive of the TLV900x family is 500 pF, and the resistive open-loop output impedance makes stabilization easier with much higher capacitive loads. These op amps are designed specifically for low-voltage operation (1.8 V to 5.5 V) with performance specifications similar to the TLV600x devices.
The robust design of the TLV900x family simplifies circuit design. The op amps feature unity-gain stability, an integrated RFI and EMI rejection filter, and no-phase reversal in overdrive conditions.
The TLV900x devices include a shutdown mode (TLV9001S, TLV9002S, and TLV9004S) that allow the amplifiers to switch off into standby mode with typical current consumption less than 1 µA.
Micro-size packages, such as SOT-553 and WSON, are offered for all channel variants (single, dual, and quad), along with industry-standard packages such as SOIC, MSOP, SOT-23, and TSSOP packages.
技術文件
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-23 (DBV) | 6 | Ultra Librarian |
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點