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TPIC1021
- LIN physical layer specification revision 2.1 compliant conforms to SAEJ2602 recommended practice for LIN
- LIN bus speed up to 20 kbps
- ESD protection to 12 kV (human body model) on LIN pin
- LIN pin handles voltage from –40 V to 40 V
- Survives transient damage in automotive environment (ISO 7637)
- Operation with supply from 7-V to 27-V DC
- Two operation modes: normal and low-power (sleep) mode
- Low current consumption in low power mode
- Wake-up available from LIN bus, wake-up input (external switch) or host MCU
- Interfaces to MCU with 5-V or 3.3-V I/O pins
- Dominant state timeout protection on TXD pin
- Wake-up request on RXD pin
- Control of external voltage regulator (INH Pin)
- Integrated pull-up resistor and series diode for LIN responder applications
- Low EME (electromagnetic emissions), high EMI (electromagnetic immunity)
- Bus terminal short-circuit protected for short to battery or short to ground
- Thermally protected
- Ground disconnection fail-safe at system level
- Ground shift operation at system level
- Unpowered node does not disturb the network
The TPIC1021 is the LIN (Local Interconnect Network) physical interface, which integrates the serial transceiver with wake up and protection features. The LIN bus is a single wire, bi-directional bus typically used for low-speed in-vehicle networks using baud rates between 2.4 kbps and 20 kbps.
The LIN bus has two logical values: the dominant state (voltage near ground) represents a logic 0 and the recessive state (voltage near battery) and represents logic 1.
In the recessive state, the LIN bus is pulled high by the TPIC1021 internal pull-up resistor (30 kΩ) and series diode, so no external pullup components are required for responder applications. Commander applications require an external pullup resistor (1 kΩ) plus a series diode.
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檢視所有 1 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPIC1021 LIN Physical Interface datasheet (Rev. E) | PDF | HTML | 2022年 5月 31日 |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點