TPS51622
- Intel© Serial VID (SVID) Compliant
- 1- or 2-Phase Operation
- Full VR12.6 Mobile Feature Set Including Digital Current
Monitor, PS3 and PS4 Operation - 8-Bit DAC with 0.50-V to 2.30-V Output Range
- Optimized Efficiency at Light and Heavy Loads
- 8 Independent Levels of Overshoot Reduction (OSR)
and Undershoot Reduction (USR) - Driverless Configuration for Efficient High-Frequency
Switching - Supports Discrete, Power Block, PowerStage or
DrMOS MOSFET Implementations - Accurate, Adjustable Voltage Positioning
- 300-kHz to 1-MHz Frequency Selections
- Patented AutoBalance Phase Balancing
- Selectable 8-level Current Limit
- 4.5-V to 28-V Conversion Voltage Range
- Small, 4 × 4, 32-Pin, QFN PowerPad Package
The TPS51622A is a driverless, fully SVID compliant, VR12.6 step-down controller. Advanced control features such as D-CAP+ architecture with overlapping pulse support undershoot reduction (USR) and overshoot reduction (OSR) provide fast transient response, lowest output capacitance and high efficiency. The TPS51622A also supports single-phase operation in CCM or DCM for light-load efficiency. The TPS51622A integrates the full complement of VR12.6 I/O features including VR_READY (PGOOD), ALERT and VR_HOT. The SVID interface address allows programming from 0 to 7. In PS4, the quiescent power consumption of controller is typical 0.25 mW. Adjustable control of VCPU slew rate and voltage positioning round out the VR12.6 features. Paired with the new TPS51604 FET gate driver, the solution delivers exceptionally high speed and low switching loss. The TPS51622A works with selected TI Power Stage™ products for optimum efficiency as well as DrMOS products.
The TPS51622A package is a space saving, thermally enhanced 32-pin QFN that operates from –40°C to 105°C.
特別說明
詳細產品規格表和其他設計支援工具,請聯繫 IMVP@list.ti.com。
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | 2-Phase, D-CAP+™ Step-Down Controller for VR12.6 Vcpu datasheet (Rev. A) | 2013年 7月 17日 | |
Technical article | How to reduce acoustic noise of MLCCs in power applications | PDF | HTML | 2016年 8月 9日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN (RSM) | 32 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點