TPS51916
- Synchronous Buck Controller (VDDQ)
- Conversion Voltage Range: 3 V to 28 V
- Output Voltage Range: 0.7 V to 1.8 V
- 0.8% VREF Accuracy
- Selectable Control Architecture
- D-CAP™ Mode for Fast Transient Response
- D-CAP2™ Mode for Ceramic Output Capacitors
- Selectable 300 kHz, 400 kHz, 500 kHz, or 670 kHz Switching Frequencies
- Optimized Efficiency at Light and Heavy Loads with Auto-skip Function
- Supports Soft-Off in S4 and S5 States
- OCL/OVP/UVP/UVLO Protections
- Powergood Output
- 2-A LDO(VTT), Buffered Reference(VTTREF)
- 2-A (Peak) Sink and Source Current
- Buffered, Low Noise, 10-mA VTTREF Output
- 0.8% VTTREF, 20-mV VTT Accuracy
- Supports High-Z (S3) and Soft-Off (S4, S5)
- Thermal Shutdown
- 20-Pin, 3 mm × 3 mm, QFN Package
- Create a WEBENCH Design
The TPS51916 device provides a complete power supply for DDR2, DDR3, DDR3L, and DDR4 memory systems in the lowest total cost and minimum space. It integrates a synchronous buck regulator controller (VDDQ) with a 2-A sink and 2-A source tracking LDO (VTT) and buffered low noise reference (VTTREF).
The device employs D-CAP™ mode coupled with 300 kHz or 400 kHz frequencies for ease-of-use and fast transient response or D-CAP2™ mode coupled with higher 500 kHz or 670 kHz frequencies to support ceramic output capacitor without an external compensation circuit. The VTTREF tracks VDDQ/2 within excellent 0.8% accuracy. The VTT, which provides 2-A sink and 2-A source peak current capabilities, requires only 10-µF of ceramic capacitance. A dedicated LDO supply input is available.
The device also provides excellent power supply performance. It supports flexible power state control, placing VTT at high-Z in S3 and discharging VDDQ, VTT and VTTREF (soft-off) in S4 or S5 state. Programmable OCL with low-side MOSFET RDS(on) sensing, OVP, UVP, UVLO and thermal shutdown protections are also available.
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RUK) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。