TPS53627
- Intel® VR13 Serial VID (SVID) Compliant
- 1- or 2-Phase Operation
- Supports Both Droop and Non-Droop Applications
- 8-Bit DAC with 10-mV Step
- 4.5-V to 28-V Conversion Voltage Range
- Output Range: 0.5 V to 2.3 V
- Optimized Efficiency at Light and Heavy Loads
- 8 Independent Levels of Overshoot Reduction (OSR) and Undershoot Reduction (USR)
- Driverless Configuration for Efficient High-Frequency Switching
- Supports Discrete, Power Block, Power Stage™ or DrMOS MOSFET Implementations
- Accurate, Adjustable Voltage Positioning
- 300-kHz to 1-MHz Frequency Selections
- Patented AutoBalance™ Phase Balancing
- Programmable ON-Pulse Extension for Load Transient Boost
- Programmable Auto DCM and CCM Operation
- Selectable 8-level Current Limit
- Small, 4 mm × 4 mm, 32-Pin, VQFN PowerPad™ Package
The TPS53627 device is a driverless, VR13 SVID compliant, synchronous buck controller. Advanced control features such as D-CAP+ ™architecture with overlapping pulse support undershoot reduction (USR) and overshoot reduction (OSR) to provide fast transient response, lowest output capacitance and high efficiency. The device also supports single-phase operation in CCM and DCM operation for light-load efficiency boost. The device integrates a full set of VR13 I/O features including VR_READY (PGOOD), ALERT and VR_HOT. The SVID interface address allows programming from 00h to 07h. Adjustable control of VOUT slew rate can be programmed as high as 20mV/uS.
Paired with the TI NexFET™ Power Stage, this total solution delivers exceptionally high speed and low switching loss.
The TPS53627 device package is a space saving, thermally enhanced 32-pin VQFN package that operates from –40°C to +105°C.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPS53627 2-Phase, D-CAP+™ Step-Down Controller for VR13 CPU VCORE and DDR Memory datasheet | PDF | HTML | 2017年 3月 27日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN (RSM) | 32 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點