TPS60400
- Inverts Input Supply Voltage
- Up to 60-mA Output Current
- Only Three Small 1-µF Ceramic Capacitors Needed
- Input Voltage Range From 1.6 V to 5.5 V
- PowerSave-Mode for Improved Efficiency at Low-Output Currents (TPS60400)
- Device Quiescent Current Typical 65 µA
- Integrated Active Schottky-Diode for Start-up Into Load
- Small 5-Pin SOT-23 Package
- Evaluation Module Available TPS60400EVM-178
The TPS6040x family of devices generates an unregulated negative output voltage from an input voltage ranging from 1.6 V to 5.5 V. The devices are typically supplied by a preregulated supply rail of 5 V or 3.3 V. Due to its wide input voltage range, two or three NiCd, NiMH, or alkaline battery cells, as well as one Li-Ion cell can also power them.
Only three external 1-µF capacitors are required to build a complete DC-DC charge pump inverter. Assembled in a 5-pin SOT-23 package, the complete converter can be built on a 50-mm2 board area. Additional board area and component count reduction is achieved by replacing the Schottky diode that is typically needed for start-up into load by integrated circuitry.
The TPS6040x can deliver a maximum output current of 60 mA with a typical conversion efficiency of greater than 90% over a wide output current range. Three device options with 20-kHz, 50-kHz, and 250-kHz fixed-frequency operation are available. TPS60400 comes with a variable switching frequency to reduce operating current in applications with a wide load range and enables the design with low-value capacitors.
技術文件
設計與開發
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ONET1130EC-EVM — 具備雙 CDR 與整合式調變器驅動器評估模組的 11.7 Gbps 收發器
TPS60400EVM-178 — 充電泵逆變器的評估模組 (裸 PCB)
Need for use: The EVM does not contain any components. The pcb therefore first has to be populated with the appropriate components. A description of different applications that can be tested using the EVM can be found in the TPS60400EVM users guide. Samples of the TPS6040x family can be (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點