TPS61230A
- Input Voltage Range: 2.5 V to 4.5 V
- Output Voltage Range: 2.5 V to 5.5 V
- Two 21-mΩ (LS) / 18-mΩ (HS) MOSFETs
- 20-µA Quiescent Current
- 6-A Valley Switching Current Limit
- 1.15-MHz Quasi-Constant Switching Frequency
- PFM Operation at the Light Load
- 1.05-ms Soft Start Time
- True Load Disconnect
- NOT Support Vin > Vout Operation
- Output Short Protection
- Over Voltage Protection
- Thermal Shutdown
- 2.0-mm x 2.0-mm VQFN 7-Pin Package
The TPS61230A device is a high efficiency fully integrated synchronous boost converter. It integrates 6-A, 21-mΩ and 18-mΩ power switches, which is capable of delivering up to 2.4-A output current at 5-V output with the 2.5-V input supply. The low RDS_ON switches enable the power conversion efficiency up to 96% and minimize the thermal stress in very compact solution size.
The typical operating frequency is 1.15 MHz, which allows the use of small inductor and capacitors to achieve a small solution size. The TPS61230A provides an adjustable output voltage via an external resistor divider.
During the light load condition, the TPS61230A automatically enters into the PFM operation for maximizing the efficiency with the lowest quiescent current. In the shutdown by pulling EN pin to the logic low, the load is completely disconnected from the input, and the input current consumption is reduced to below 1.0 µA.
When the output is shorted, the device enters into the hiccup protection mode and recovery automatically when the output short is released. Other features like the output over voltage protection, thermal shutdown protection are integrated.
The device is available in a 2.00-mm x 2.00-mm x 0.9-mm VQFN package and requires the minimum amount of external components.
技術文件
設計與開發
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TPS61230AEVM-767 — 採用 2 mm × 2 mm QFN 封裝的 TPS61230A 6A 高效率升壓轉換器評估板
Unencrypted TPS61230A PSpice Transient Model Package (Rev. C)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN-HR (RNS) | 7 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點