TPS650242
- 1.6-A, 1.0-A, or 0.8-A, 97% Efficient Step-Down Converter for System Voltage (VDCDC1)
- 3.3 V or 2.80 V or Adjustable
- 1.6-A, 1.0-A, or 0.8-A, up to 95% Efficient Step-Down Converter for Memory Voltage (VDCDC2)
- 1.8 V or 2.5 V or Adjustable
- 0.8-A, 90% Efficient Step-Down Converter for Processor Core (VDCDC3)
- Two Selectable Voltages for VDCDC3
- TPS650240:
- DEFDCDC3 = LOW: VO = 1.0 V
- DEFDCDC3 = HIGH: VO = 1.3 V
- TPS650241:
- DEFDCDC3 = LOW: VO = 0.9 V
- DEFDCDC3 = HIGH: VO= 1.375 V
- TPS650242:
- DEFDCDC3 = LOW: VO = 1.0 V
- DEFDCDC3 = HIGH: VO = 1.5 V
- TPS650243:
- DEFDCDC3 = LOW: VO = 1.0 V
- DEFDCDC3 = HIGH: VO = 1.2 V
- TPS650244:
- DEFDCDC3 = LOW: VO = 1.55 V
- DEFDCDC3 = HIGH: VO = 1.6 V
- TPS650245:
- DEFDCDC3 = LOW: VO = 0.9 V
- DEFDCDC3 = HIGH: VO = 1.1 V
- TPS650240:
- 30-mA LDO for Vdd_alive
- 2 × 200-mA General-Purpose LDOs (LDO1 and LDO2)
- Dynamic Voltage Management for Processor Core
- LDO1 and LDO2 Voltage Externally Adjustable
- Separate Enable Pins for Inductive Converters
- 2.25-MHz Switching Frequency
- 85-μA Quiescent Current
- Thermal Shutdown Protection
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The TPS65024x devices are integrated power management ICs for applications powered by one Li-Ion or Li-Polymer cell, which require multiple power rails. The TPS65024x provide three highly efficient, step-down converters targeted at providing the core voltage, peripheral, I/O, and memory rails in a processor-based system. All three step-down converters enter a low power mode at light load for maximum efficiency across the widest possible range of load currents. The converters can be forced into fixed-frequency PWM mode by pulling the MODE pin high.
技術文件
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檢視所有 2 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPS65024x Power Management ICs for Li-Ion Powered Systems datasheet (Rev. C) | PDF | HTML | 2016年 1月 6日 |
Application note | Optimizing Resistor Dividers at a Comparator (Rev. B) | PDF | HTML | 2021年 4月 30日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN (RHB) | 32 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點