TPS65175C
- 8.6V to 14.7V Input Voltage Range
- Boost Converter VDD: 12.7V…19V (6-Bit)
- Integrated Input-to-Output Isolation Switch
- Buck Converter HVDD: VDD Tracking
- Buck Converter VCC: 1.6V...2.0V & 3.0V…3.6V (4-Bit)
- Positive Charge Pump VGH:
- 19V…34V for Low Temperature (4-Bit)
- 17V…32V for High Temperature (4-Bit)
- Negative Charge Pump VGL: –1.8V…–8.1V (6-Bit)
- 6-Ch Gamma Buffer:
- 3-Ch: VDD…HVDD (9-Bit)
- 3-Ch: HVDD...GND (9-Bit)
- 9-Bit VCOM Reference
- 3-Bit VCOM Gain
- VCOM_DAC Output for External Operational Amplifier Reference
- Temperature Compensation for VGH and VCOM
- Reset Signal with Programmable Delay Time
- Programmable Sequencing Delays (4 × 3-Bit)
- Thermal Shutdown
- 12-Channel Level Shifters:
- Supports Forward and Reverse Operation
- Abnormal Operation Detection
- 56-Pin 7-mm × 7-mm QFN Package
The TPS65175B/C provides a simple and economic power supply solution for a wide variety of LCD bias applications. The device provides all supply rails needed by a TFT-LCD panel but also 6 gamma references, a supply rail for LVDS support, as well as a Vcom reference. The device also integrates a VCOM_DAC rail providing the reference for an external non-inverting operational amplifier input. A 12-Channel Level Shifter is also integrated. The solution is delivered in a small 7×7 mm QFN package.
The TPS65175B/C provides a simple and economic power supply solution for a wide variety of LCD bias applications. The device provides all supply rails needed by a TFT-LCD panel. VCC and RST for the T-Con. VDD and HVDD for the Source Driver. VGH and VGL for the Gate Driver or the Level Shifters. A VCOM operational amplifier is also integrated to provide a common plane reference. The VGH and VCOM / VCOM_DAC voltages can be compensated for low and high temperatures. The transition from one programmed value to another is made using an external thermistor connected to the IC. In addition, a 6-channel Gamma Buffer as well as a 12-Channel Level Shifter are integrated. All output rails and delay times are programmable by a two-wire interface: a single BOM (Bill of Material) can cover several panel types and sizes whose desired output levels can be programmed in production and stored in a non-volatile memory embedded into the TPS65175B/C. The solution is delivered in a small 7 mm × 7 mm QFN-56 package.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPS65175B/C 1 page email address datasheet | 2013年 7月 24日 | |
Application note | Basic Calculation of a Boost Converter's Power Stage (Rev. D) | PDF | HTML | 2022年 10月 28日 | |
Application note | Understanding Undervoltage Lockout in Power Devices (Rev. A) | 2018年 9月 19日 | ||
Application note | Basic Calculation of a Buck Converter's Power Stage (Rev. B) | 2015年 8月 17日 | ||
Application note | Minimizing Ringing at the Switch Node of a Boost Converter | 2006年 9月 15日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VQFN (RSH) | 56 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。