TPS65921
- Three Step-Down Converters:
- Up to 1.2 A of Output Current for VDD1
- TPS65921B Supports VDD1 up to 1.2 A
- TPS65921B1 Supports VDD1 up to 1.4 A (Necessary for 1-GHz Operation)
- SmartReflex Dynamic Voltage Management
- 3.2-MHz Fixed Frequency Operation
- VIN Range from 2.7 to 4.5 V
- Typical 30 µA Quiescent per Converter
- Up to 1.2 A of Output Current for VDD1
- Four General-Purpose Configurable LDOs:
- Dynamic Voltage Scaling
- 220-mA Maximum Current for One LDO
- VIN Range from 2.7 to 4.5 V
- 2 LDOs With Low Noise and High PSRR
- RTC With Alarm Wake-Up Mechanism
- Clock Management
- 32-kHz Crystal Oscillator
- Clock Slicer for 26, 19.2, and 38.4 MHz
- HF Clock Output Buffer
- USB:
- USB HS 2.0 Transceiver
- USB 1.3 OTG-Compliant
- 12-Bit ULPI 1.1 Interface
- USB Power Supply (5-V CP for VBUS)
- Control
- High-Speed I2C Interface
- All Resource Configurable by I2C
- Keypad Interface up to 8 × 8
- 10-Bit A/D Converter
- Hot-Die, Thermal Shutdown Protection
- µ*BGA 120 Balls ZQZ
The TPS65921 device is a highly integrated power-management circuit (IC) that supports the power and peripheral requirements of the OMAP application processors. The device contains power management, a universal serial bus (USB) high-speed (HS) transceiver, an analog-to-digital converter (ADC), a real-time clock (RTC), a keypad interface, and an embedded power control (EPC). The power portion of the device contains three buck converters, two controllable by a dedicated SmartReflex class-3 interface, multiple low-dropout (LDO) regulators, an EPC to manage the power-sequencing requirements of OMAP, and an RTC module. The USB module provides an HS 2.0 transceiver suitable for direct connection to the OMAP universal transceiver macrocell interface (UTMI) + low pin interface (ULPI) with an integrated charge pump (CP).
The device also provides auxiliary modules: ADC, keypad interface, and general-purpose inputs/outputs (GPIOs) muxed with the JTAG functions. The keypad interface implements a built-in scanning algorithm to decode hardware-based key presses and to reduce software use, with multiple additional GPIOs that can be used as interrupts when they are configured as inputs.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPS65921 Power Management and USB Single Chip datasheet (Rev. G) | PDF | HTML | 2014年 9月 29日 |
* | Errata | TPS65921 Silicon Errata | 2010年 9月 8日 | |
User guide | IPM MicroStar BGA Discontinued and Redesigned | 2020年 11月 3日 | ||
Selection guide | Power Management Guide 2018 (Rev. R) | 2018年 6月 25日 | ||
Application note | TPS65921 PCB Layout Guidelines (Rev. A) | 2012年 3月 15日 | ||
User guide | TPS65921 Register Manual (Rev. C) | 2012年 3月 15日 | ||
Application note | Using Power IC for OMAP34xx to 36xx Family | 2011年 1月 24日 | ||
User guide | Differences in Features for TPS65920 and TPS65921 (Rev. B) | 2010年 12月 17日 | ||
Application note | TPS65950/930/920/921 USB Eye Diagram Trimming | 2010年 11月 19日 | ||
Application note | TPS65921 USB Charger Detection | 2010年 11月 17日 |
設計與開發
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TWL4030SW-LINUX — 適用於 TWL4030 的 Linux 驅動程式
Linux Mainline Status
Available in Linux Main line: Yes
Available through git.ti.com: N/A
Supported Devices:
- twl4030
- (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
JRBGA (ZQZ) | 120 | Ultra Librarian |
NFBGA (ZBH) | 120 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點