TPS727
- Very Low Dropout:
- 65 mV Typical at 100 mA
- 130 mV Typical at 200 mA
- 163 mV Typical at 250 mA
- 2% Accuracy Over Load, Line, Temperature
- Ultralow IQ: 7.9 µA
- Excellent Load Transient Performance:±50 mV for
200 mA Loading and Unloading Transient - Available in Fixed-Output Voltages From 0.9 V to
5 V Using Innovative Factory EEPROM Programming - High PSRR: 70 dB at 1 kHz
- Stable with a 1.0-µF Ceramic Capacitor
- Thermal Shutdown and Overcurrent Protection
- Available in 4-Ball, 0.4-mm Pitch Wafer-Level
Chip Scale and 1.5-mm × 1.5-mm SON Packages
The TPS727 family of low-dropout (LDO) linear regulators are ultralow quiescent current LDOs with excellent line and ultra-fast load transient performance and are designed for power-sensitive applications. The LDO output voltage level is preset by the use of innovative factory EEPROM programming. A precision band-gap and error amplifier provides overall 2% accuracy over load, line, and temperature extremes. The TPS727 family is available in 1.5-mm × 1.5-mm SON and wafer chip-scale (WCSP) packages that make the devices ideal for handheld applications. This family of devices is fully specified over a temperature range of TJ = –40°C to +125°C.
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檢視所有 9 類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPS727 250-mA, Ultralow IQ, Fast Transient Response, RF Low-Dropout Linear Regulator datasheet (Rev. F) | PDF | HTML | 2015年 12月 1日 |
White paper | Understanding the Foundations of Quiescent Current in Linear Power Systems | 2021年 2月 18日 | ||
Application note | LDO Noise Demystified (Rev. B) | PDF | HTML | 2020年 8月 18日 | |
Application note | A Topical Index of TI LDO Application Notes (Rev. F) | 2019年 6月 27日 | ||
Selection guide | Power Management Guide 2018 (Rev. R) | 2018年 6月 25日 | ||
Selection guide | Low Dropout Regulators Quick Reference Guide (Rev. P) | 2018年 3月 21日 | ||
Application note | LDO PSRR Measurement Simplified (Rev. A) | PDF | HTML | 2017年 8月 9日 | |
EVM User's guide | TPS727xxYFF EVM Users Guide | 2010年 2月 24日 | ||
EVM User's guide | TPS727xxDSE EVM Users Guide | 2009年 8月 21日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
開發板
TPS72715DSEEVM-406 — TPS72715DSEEVM-406 評估模組
The TPS72715DSEEVM-406 evaluation module is a fully assembled and tested circuit for evaluating the TPS72715 low-dropout linear regulator in the DSE (1.5 x 1.5mm SON-6) package.
使用指南: PDF
開發板
TPS72715YFFEVM-407 — 採用 YFF 封裝的 TPS72715 LDO 線性穩壓器評估模組
The TPS72715YFFEVM-407 evaluation module is a fully assembled and tested circuit for evaluating the TPS72715 RF Low-Dropout Linear Regulator in the YFF (WCSP-4) package.
使用指南: PDF
開發板
TPS72718DSEEVM-406 — TPS72718DSEEVM-406 評估模組
The TPS72718DSEEVM-406 evaluation module is a fully assembled and tested circuit for evaluating the TPS72718 low-dropout linear regulator in the DSE (1.5 x 1.5mm SON-6) package.
使用指南: PDF
開發板
TPS72718YFFEVM-407 — 採用 YFF 封裝的 TPS72718 RF LDO 線性穩壓器評估模組
The TPS72718YFFEVM-407 evaluation module is a fully assembled and tested circuit for evaluating the TPS72718 RF Low-Dropout Linear Regulator in the YFF (WCSP-4) package.
使用指南: PDF
參考設計
TIDA-010018 — 適用於低功耗應用的隔離式電源和數據介面參考設計
This reference design provides power and data isolation for low and ultra-low power applications. Generating isolated and non-isolated power rails with a high efficiency and containing a power efficient isolated data interface for three forward- plus one reverse-direction channels. Targeted (...)
參考設計
TIDA-010019 — 溫度感測器中適用於冷接點補償法的 RTD 更換參考設計
Temperature-sensing applications that use a thermocouple (TC) require an accurate local temperature sensor to achieve high accuracy. Solutions for design challenges such as cold-junction compensation (CJC) or including an ultra-low power TC analog front-end are highlighted and addressed in this (...)
參考設計
TIDM-RF-SENSORNODE — 適用於 6LoWPAN 和 2.4 GHz 應用的射頻感測器節點開發平台
The RF Sensor Node Platform is intended as a miniature development platform for 6LoWPAN and 2.4 GHz applications. The platform has three on-board sensors which includes a 3-axis accelerometer, a temperature sensor and two light sensors. The RF Sensor Node Platform can be a stand-alone sensor node (...)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
DSBGA (YFF) | 4 | Ultra Librarian |
WSON (DSE) | 6 | Ultra Librarian |
訂購與品質
內含資訊:
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊:
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。