首頁 電源管理 DC/DC 電源模組 電源模組 (整合式電感器)
首頁
電源管理
DC/DC 電源模組
電源模組 (整合式電感器)

TPS826711

現行

採用 MicroSiP™ 封裝的 600mA 完全整合、低雜訊降壓式轉換器

立即訂購
產品規格表

TPS826711

現行
產品規格表 立即訂購

產品詳細資料

Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 0.6 Vin (min) (V) 2.3 Vin (max) (V) 4.8 Vout (min) (V) 1.8 Vout (max) (V) 1.8 Switching frequency (min) (kHz) 4900 Switching frequency (max) (kHz) 6000 Features Enable, Light Load Efficiency, Output discharge, Spread Spectrum Control mode Constant on-time (COT) Duty cycle (max) (%) 78
Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 0.6 Vin (min) (V) 2.3 Vin (max) (V) 4.8 Vout (min) (V) 1.8 Vout (max) (V) 1.8 Switching frequency (min) (kHz) 4900 Switching frequency (max) (kHz) 6000 Features Enable, Light Load Efficiency, Output discharge, Spread Spectrum Control mode Constant on-time (COT) Duty cycle (max) (%) 78
uSIP (SIP) 8 6.67 mm² 2.3 x 2.9
  • 90% Efficiency at 5.5 MHz Operation
  • 17µA Quiescent Current
  • Wide VIN Range From 2.3 V to 4.8 V
  • 5.5MHz Regulated Frequency Operation
  • Spread Spectrum, PWM Frequency Dithering
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • ≥35dB VIN PSRR (1kHz to 10kHz)
  • Internal Soft Start, 120-µs Start-Up Time
  • Integrated Active Power-Down Sequencing
    (Optional)
  • Current Overload and Thermal Shutdown
    Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <6.7 mm2
  • 90% Efficiency at 5.5 MHz Operation
  • 17µA Quiescent Current
  • Wide VIN Range From 2.3 V to 4.8 V
  • 5.5MHz Regulated Frequency Operation
  • Spread Spectrum, PWM Frequency Dithering
  • Best in Class Load and Line Transient
  • ±2% Total DC Voltage Accuracy
  • Automatic PFM/PWM Mode Switching
  • Low Ripple Light-Load PFM Mode
  • ≥35dB VIN PSRR (1kHz to 10kHz)
  • Internal Soft Start, 120-µs Start-Up Time
  • Integrated Active Power-Down Sequencing
    (Optional)
  • Current Overload and Thermal Shutdown
    Protection
  • Sub 1-mm Profile Solution
  • Total Solution Size <6.7 mm2

The TPS8267x device is a complete 600mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design.

The TPS8267x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSiP™ DC/DC converter operates at a regulated 5.5-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the quiescent current to 17µA (typ) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency.

The TPS8267x is packaged in a compact (2.3mm × 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.

The TPS8267x device is a complete 600mA, DC/DC step-down power supply intended for low-power applications. Included in the package are the switching regulator, inductor and input/output capacitors. No additional components are required to finish the design.

The TPS8267x is based on a high-frequency synchronous step-down dc-dc converter optimized for battery-powered portable applications. The MicroSiP™ DC/DC converter operates at a regulated 5.5-MHz switching frequency and enters the power-save mode operation at light load currents to maintain high efficiency over the entire load current range.

The PFM mode extends the battery life by reducing the quiescent current to 17µA (typ) during light load operation. For noise-sensitive applications, the device has PWM spread spectrum capability providing a lower noise regulated output, as well as low noise at the input. These features, combined with high PSRR and AC load regulation performance, make this device suitable to replace a linear regulator to obtain better power conversion efficiency.

The TPS8267x is packaged in a compact (2.3mm × 2.9mm) and low profile (1.0mm) BGA package suitable for automated assembly by standard surface mount equipment.
filter 尋找其它 電源模組 (整合式電感器)
下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
功能相同，但引腳輸出與所比較的裝置不同
TPS82671 現行 採用 MicroSiP™ 封裝的 600mA 完全整合、低雜訊降壓式轉換器 Pin-to-pin alternative without active capacitor discharge

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件，然後再試一次。
檢視所有 6
類型 標題 日期
* Data sheet TPS8267x 600-mA, High-Efficiency MicroSiP Step-Down Converter (Profile <1.0mm) datasheet (Rev. J) PDF | HTML 2016年 4月 13日
User guide Manufacturing and Rework Design Guide for MicroSiP™ Power Modules (Rev. A) PDF | HTML 2021年 6月 16日
Analog Design Journal Understanding 100% mode in low-power DC/DC converters 2018年 6月 22日
Analog Design Journal Testing tips for applying external power to supply outputs without an input voltage 2016年 10月 24日
White paper SiP Power Modules White Paper 2016年 1月 26日
Analog Design Journal IQ: What it is, what it isn’t, and how to use it 2011年 6月 17日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TPS82671EVM-646 — 適用於 TPS82671 600mA、1.8Vout 完全整合、低雜訊降壓轉換器的評估模組

The TPS82671EVM-646 is a fully assembled and tested platform for evaluating the performance of the TPS82671 high-frequency, synchronous, step-down dc-dc convertersoptimized for battery-powered portable applications. The TPS82671 and TPS82675 devices are series of high-frequency, synchronous, (...)

使用指南: PDF
TI.com 無法提供
封裝 針腳 CAD 符號、佔位空間與 3D 模型
uSIP (SIP) 8 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

影片