UCC2813-5-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C TA
- Device HBM classification level 2: ±2 kV
- Device CDM classification level C5: >1000 V
- 100-µA typical starting supply current
- 500-µA typical operating supply current
- Operation to 1 MHz
- Internal soft start
- Internal fault soft start
- Internal leading-edge blanking of the current-sense signal
- 1-A totem-pole output
- 70-ns typical response from current-sense to gate-drive output
- 1.5% tolerance voltage reference
- Same pinout as the UCC3802 device, UC3842 device, and UC3842A device families
The UCC2813-x-Q1 device family of high-speed, low-power integrated circuits contains all of the control and drive components required for off-line and DC-to-DC fixed-frequency current-mode switching power supplies with minimal parts count.
These devices have the same pin configuration as the UC284x device family, and also offer the added features of internal full-cycle soft start and internal leading-edge blanking of the current-sense input.
The UCC2813-x-Q1 device family offers a variety of package options, choice of maximum duty cycle, and choice of critical voltage levels. Devices with lower reference voltage such as the UCC2813-3-Q1 and UCC2813-5-Q1 fit best into battery operated systems, while the higher reference and the higher UVLO hysteresis of the UCC2813-2-Q1 device and UCC2813-4-Q1 device make these ideal choices for use in off-line power supplies.
The UCC2813-x-Q1 device series is specified for operation from –40°C to 125°C.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | UCC2813-x-Q1 Low-Power Economy BiCMOS Current-Mode PWM datasheet (Rev. E) | PDF | HTML | 2017年 7月 25日 |
Technical article | Are you on-board? Demystifying EV charging systems | PDF | HTML | 2017年 7月 31日 |
設計與開發
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UCCX805 & UCCX813-5 TINA-TI Startup Reference Design
UCCX805 & UCCX813-5 TINA-TI Steady State Reference Design
UCCx805, UCCx813-5 Families PSpice Transient Model (Rev. B)
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點