UCD74120
- Integrates Synchronous Buck Driver and NexFET™ Power MOSFETS for High Power Density and High Efficiency
- 25-A Output Current Capability for DSP and ASIC
- 4.7-V to 14-V Input Voltage Range
- Operational up to 2 MHz Switching Frequency
- Built-In High-Side Current Protection
- DCR Current Sensing for Overcurrent Protection and Output Current Monitoring
- Voltage Proportional to Load Current Monitor Output
- Tri-state PWM Input for Power Stage Shutdown
- UVLO Housekeeping Circuit
- Integrated Thermal Shutdown
- 40-Pin, 5 mm x 7 mm, PQFN PowerStack™ Package
UCD74120 is a multi-chip module integrating a driver device and two NexFET power MOSFETs into a thermally enhanced compact, 5 mm × 7 mm, QFN package. A 25-A output current capability makes the device suitable for powering DSP and ASIC. The device is designed to complement digital or analog PWM controllers. The PWM input of the driver device is 3-state compatible. Two driver circuits provide high charge and discharge current for the high-side N-channel FET switch and the low-side N-channel FET synchronous rectifier in a synchronous buck converter.
Output current is measured and monitored by a precision current sensing amplifier that processes the voltage present across an external current sense element. The amplified signal is available for use by the PWM controller on the IMON pin. On-board comparators monitor the voltage across the high-side switch and the voltage across the external current sense element to safeguard the power stage from sudden high-current loads. Blanking delay is set for the high-side comparator by a single resistor in order to avoid false reports coincident with switching edge noise. In the even of a high-side fault or an overcurrent fault, the high-side FET is turned off and the fault flag (FLT) is asserted to alert the PWM controller.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | High-Current, Synchronous Buck Power Stage datasheet | 2011年 12月 23日 | |
Selection guide | Power Management Guide 2018 (Rev. R) | 2018年 6月 25日 | ||
Application note | UCD74120 Power Sequence Requirement | 2015年 10月 26日 |
設計與開發
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封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
LQFN-CLIP (RVF) | 40 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點