FDC2212-Q1
2-kanaliger Kapazitäts-Digital-Wandler, 28 Bit, für die Automobilindustrie
FDC2212-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- EMI-resistant architecture
- Maximum output rates (one active channel):
- 13.3kSPS (FDC2112-Q1, FDC2114-Q1)
- 4.08kSPS (FDC2212-Q1, FDC2214-Q1)
- Maximum input capacitance: 250nF (at 10kHz with 1mH inductor)
- Sensor excitation frequency: 10kHz to 10MHz
- Number of channels: 2, 4
- Resolution: up to 28 bits
- RMS noise: 0.3fF at 100SPS and fSENSOR = 5MHz
- Supply voltage: 2.7V to 3.6V
- power consumption: active: 2.1mA
- Low-power sleep mode: 35µA
- Shutdown: 200nA
- Interface: I2C
- Temperature range: –40°C to +125°C
Capacitive sensing is a low-power, high-resolution contactless sensing technique that can be applied to a variety of applications ranging from proximity detection to gesture recognition. The sensor in a capacitive sensing system is any metal or conductor, allowing for highly flexible system design.
The main challenge limiting sensitivity in capacitive sensing applications is noise susceptibility of the sensors. With the FDC2x1x-Q1 resonant sensing architecture, performance can be maintained even in presence of fluorescent light.
The FDC2x1x-Q1 is a multi-channel family of high-resolution, high-speed capacitance-to-digital converters for implementing capacitive sensing solutions. The devices employ an innovative narrow-band based architecture to offer high rejection of noise while providing high resolution at high speed. The devices support a wide excitation frequency range, offering flexibility in system design.
Technische Dokumentation
Typ | Titel | Datum | ||
---|---|---|---|---|
* | Data sheet | FDC2x1x-Q1 Multi-Channel, High Resolution Capacitance-to-Digital Converter for Capacitive Sensing Applications datasheet (Rev. A) | PDF | HTML | 10 Okt 2024 |
Application note | Common Inductive and Capacitive Sensing Applications (Rev. B) | PDF | HTML | 22 Jun 2021 | |
Application note | Simulate Inductive Sensors Using FEMM (Finite Element Method Magnetics) (Rev. A) | PDF | HTML | 16 Jun 2021 | |
Application note | Capacitive Proximity Sensing Using FDC2x1y (Rev. A) | 20 Okt 2017 | ||
EVM User's guide | FDC2114 and FDC2214 EVM User’s Guide (Rev. A) | 14 Sep 2016 | ||
Application note | Ground Shifting in Capacitive Sensing Applications | PDF | HTML | 27 Mai 2016 | |
Application note | Power Consumption Analysis for Low Power Capacitive Sensing Applications | PDF | HTML | 18 Jan 2016 | |
Application note | Derivative Integration Algorithm for Proximity Sensing | 29 Sep 2015 | ||
Application note | Capacitive Sensing: Direct vs Remote Liquid Level Sensing Performance Analysis (Rev. A) | 24 Jul 2015 |
Design und Entwicklung
Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.
FDC2214EVM — Evaluierungsmodul für FDC2214 mit zwei kapazitiven Sensoren
The FDC2214 evaluation module demonstrates capacitive sensing technology to detect the presence of a conductive or non-conductive target. The evaluation module includes two PCB capacitive sensors that connect to two of the four channels of the FDC2214. An MSP430 microcontroller is used to interface (...)
SNOC033 — FDC211x/FDC221x Current Consumption Estimator
Unterstützte Produkte und Hardware
Produkte
Signalumformer
TIDA-01409 — Kapazitives Kick-to-Open für die Automobilindustrie – Referenzdesign
Gehäuse | Pins | CAD-Symbole, Footprints und 3D-Modelle |
---|---|---|
WSON (DNT) | 12 | Ultra Librarian |
Bestellen & Qualität
- RoHS
- REACH
- Bausteinkennzeichnung
- Blei-Finish/Ball-Material
- MSL-Rating / Spitzenrückfluss
- MTBF-/FIT-Schätzungen
- Materialinhalt
- Qualifikationszusammenfassung
- Kontinuierliches Zuverlässigkeitsmonitoring
- Werksstandort
- Montagestandort
Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.
Support und Schulungen
TI E2E™-Foren mit technischem Support von TI-Ingenieuren
Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.
Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support.