인터페이스 I2C & I3C ICs I2C & I3C level shifters, buffers & hubs

TCA4311A

활성

2비트 양방향 2.7~5.5V 핫 스왑 가능 400kHz I2C/SMBus 버퍼

제품 상세 정보

Features Buffer, Enable pin, Hot swap Frequency (max) (MHz) 0.4 VCCA (min) (V) 2.7 VCCA (max) (V) 5.5 VCCB (min) (V) 2.7 VCCB (max) (V) 5.5 Supply restrictions VCC Single Supply Rating Catalog Operating temperature range (°C) -40 to 85
Features Buffer, Enable pin, Hot swap Frequency (max) (MHz) 0.4 VCCA (min) (V) 2.7 VCCA (max) (V) 5.5 VCCB (min) (V) 2.7 VCCB (max) (V) 5.5 Supply restrictions VCC Single Supply Rating Catalog Operating temperature range (°C) -40 to 85
  • Operating Power-Supply Voltage Range of 2.7 V to 5.5 V
  • Supports Bidirectional Data Transfer of I2C Bus Signals
  • SDA and SCL Lines are Buffered Which Increases Fanout
  • 1-V Precharge on all SDA and SCL Lines Prevents Corruption During Live Board Insertion and Removal From Backplane
  • SDA and SCL Input Lines are Isolated From Outputs
  • Accommodates Standard Mode and Fast Mode I2C Devices
  • Improved Noise Immunity
  • Applications Include Hot Board Insertion and Bus Extension
  • Low ICC Chip Disable of < 1 µA
  • READY Open-Drain Output
  • Supports Clock Stretching, Arbitration, and Synchronization
  • Powered-Off High-Impedance I2C Pins
  • Open-Drain I2C Pins
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 8000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Operating Power-Supply Voltage Range of 2.7 V to 5.5 V
  • Supports Bidirectional Data Transfer of I2C Bus Signals
  • SDA and SCL Lines are Buffered Which Increases Fanout
  • 1-V Precharge on all SDA and SCL Lines Prevents Corruption During Live Board Insertion and Removal From Backplane
  • SDA and SCL Input Lines are Isolated From Outputs
  • Accommodates Standard Mode and Fast Mode I2C Devices
  • Improved Noise Immunity
  • Applications Include Hot Board Insertion and Bus Extension
  • Low ICC Chip Disable of < 1 µA
  • READY Open-Drain Output
  • Supports Clock Stretching, Arbitration, and Synchronization
  • Powered-Off High-Impedance I2C Pins
  • Open-Drain I2C Pins
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 8000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

The TCA4311A is a hot-swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock busses. Control circuitry prevents the backplane from being connected to the card until a stop command or bus idle occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the chip.

When the I2C bus is idle, the TCA4311A can be put into shutdown mode by setting the EN pin low. When EN is high, the TCA4311A resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

Both the backplane and card may be powered with supply voltages ranging from 2.7 V to 5.5 V, with no restrictions on which supply voltage is higher.

The TCA4311A has standard open-drain I/Os. The size of the pull-up resistors to the I/Os depends on the system, but each side of this buffer must have a pull-up resistor. The device is designed to work with Standard Mode and Fast Mode I2C devices in addition to SMBus devices. Standard Mode I2C devices only specify 3 mA in a generic I2C system where Standard Mode devices and multiple masters are possible. Under certain conditions, high termination currents can be used.

The TCA4311A is a hot-swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock busses. Control circuitry prevents the backplane from being connected to the card until a stop command or bus idle occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the chip.

When the I2C bus is idle, the TCA4311A can be put into shutdown mode by setting the EN pin low. When EN is high, the TCA4311A resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

Both the backplane and card may be powered with supply voltages ranging from 2.7 V to 5.5 V, with no restrictions on which supply voltage is higher.

The TCA4311A has standard open-drain I/Os. The size of the pull-up resistors to the I/Os depends on the system, but each side of this buffer must have a pull-up resistor. The device is designed to work with Standard Mode and Fast Mode I2C devices in addition to SMBus devices. Standard Mode I2C devices only specify 3 mA in a generic I2C system where Standard Mode devices and multiple masters are possible. Under certain conditions, high termination currents can be used.

다운로드

관심 가지실만한 유사 제품

open-in-new 대안 비교
비교 대상 장치와 동일한 기능을 지원하는 핀 대 핀
TCA9511A 활성 2비트 양방향 2.3~5.5V 핫 스왑 가능 400kHz I2C/SMBus 버퍼 The pin-to-pin device has improved performance (wider supply voltage rail, lower voltage offset, and wider temperature range).

기술 자료

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* Data sheet TCA4311A Hot Swappable 2-Wire Bus Buffers datasheet (Rev. C) PDF | HTML 2018/08/16

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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