TMP101-Q1
- AEC-Q100 qualified with the following results:
- Temperature grade 1: −55°C to +125°C operating temperature range
- HBM ESD component classification level 2
- CDM ESD component classification level C5
- Functional Safety-Capable
- Digital output: SMBus™, two-wire, and I2C interface compatibility
- Resolution: 9 to 12 bits, user-selectable
- Accuracy:
- ±1°C (typical) from –55°C to 125°C
- ±2°C (maximum) from –55°C to 125°C
- Low quiescent current: 45-µA, 0.1-µA standby
- Wide supply range: 2.7 V to 5.5 V
- TMP100-Q1 features two address pins
- TMP101-Q1 features one address pin and an ALERT pin
- 6-pin SOT-23 package
The TMP100-Q1 and TMP101-Q1 devices are digital temperature sensors designed for negative temperature coefficient (NTC) and positive temperature coefficient (PTC) thermistor replacement. The devices offer a typical accuracy of ±1°C without requiring calibration or external component signal conditioning. Device temperature sensors are highly linear and do not require complex calculations or look-up tables to derive the temperature. The on-chip, 12-bit ADC offers resolutions down to 0.0625°C. The devices are available in 6-Pin SOT-23 packages.
The TMP100-Q1 and TMP101-Q1 devices feature SMBus, Two-Wire, and I2C interface compatibility. The TMP100-Q1 device allows up to eight devices on one bus. The TMP101-Q1 device offers an SMBus Alert function with up to three devices per bus.
The TMP100-Q1 and TMP101-Q1 devices are designed for extended temperature measurement in a variety of communication, computer, consumer, environmental, industrial, and instrumentation applications.
The TMP100-Q1 and TMP101-Q1 devices are specified for operation over a temperature range of −55°C to 125°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TMP100-Q1 and TMP101-Q1 Temperature Sensor With I2C and SMBus Interface with Alert Function in SOT-23 Package datasheet (Rev. B) | PDF | HTML | 2022/06/17 |
Technical article | How to maximize powertrain efficiency and reliability with high-accuracy temperatu | PDF | HTML | 2021/05/10 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOT-23 (DBV) | 6 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치