TMP108
- Dynamically-programmable limit window with under- and overtemperature alerts
- Accuracy:
±0.75°C (maximum) from –20°C to +85°C
±1°C (maximum) from –40°C to +125°C - Low quiescent current:
6 µA active (maximum) from –40°C to +125°C - Supply range: 1.4 V to 3.6 V
- Resolution: 12 bits (0.0625°C)
- Package: 1.2-mm × 0.8-mm, 6-ball WCSP
TMP108 is a digital-output temperature sensor with a dynamically-programmable limit window, and under- and overtemperature alert functions. These features provide optimized temperature control without the need of frequent temperature readings by the controller or application processor.
The TMP108 features SMBus and two-wire interface compatibility, and allows up to four devices on one bus with the SMBus alert function.
The TMP108 is designed for thermal management optimization in a variety of consumer, computer, and environmental applications. The device is specified over a temperature range of –40°C to +125°C.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | Low-Power Digital Temperature Sensor with Two-Wire Interface in WCSP datasheet (Rev. A) | 2019/09/25 | |
Application note | How to Read and Interpret Digital Temperature Sensor Output Data | PDF | HTML | 2024/04/12 | |
Technical article | Interface to sensors in seconds with ASC Studio | PDF | HTML | 2020/11/12 | |
Application note | How to Boost Your CPU, GPU, and SoC Performance Through Thermal Accuracy | PDF | HTML | 2020/09/22 | |
EVM User's guide | TMP108EVM User's Guide | 2019/09/09 | ||
Application note | Temperature sensors: PCB guidelines for surface mount devices (Rev. A) | 2019/01/18 | ||
EVM User's guide | TMP108EVM Users Guide | 2013/04/05 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TMP108EVM — TMP108EVM - WCSP에서 2선 인터페이스를 사용한 TMP108 디지털 온도 센서 평가
The TMP108EVM is a platform for evaluating the TMP108 Low-Power Digital Temperature Sensor with Two-Wire Interface in WCSP. The included USB interface hardware makes evaluation simple; no additional hardware or instruments are required.
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
DSBGA (YFF) | 6 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치