TMP75B-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Temperature grade 1: –40°C to 125°C
- HBM ESD classification 2
- CDM ESD classification C4B
- Tri-Temp tested option: TMP75BTQDGKRQ1
- Functional Safety-Capable
- Digital output with two-wire serial interface
- Up to eight pin-programmable bus addresses
- Programmable overtemperature ALERT
- Shutdown mode for power saving
- One-shot conversion mode
- Operating temperature range: –40°C to 125°C
- Operating supply range: 1.4V to 3.6V
- Quiescent current:
- 45µA Active (typical)
- 0.3µA Shutdown (typical)
- Accuracy:
- ±0.5°C (typical) from –20°C to 85°C
- ±1°C (typical) from –40°C to 125°C
- Resolution: 12 bits (0.0625°C)
- Packages: SOIC-8 and VSSOP-8
The TMP75B-Q1 is an integrated digital temperature sensor with a 12-bit analog-to-digital converter (ADC) that can operate at a 1.8V supply, and is pin and register compatible with the industry-standard LM75 and TMP75. This device is available in SOIC-8 and VSSOP-8 packages, and requires no external components to sense the temperature. The TMP75B-Q1 is capable of reading temperatures with a resolution of 0.0625°C with operating temperature range of –40°C to 125°C. The TMP75BTQDGKRQ1 is tri-temperature (–40°C, 25°C, and 125°C) tested in production for improved robustness.
The TMP75B-Q1 features SMBus and two-wire interface compatibility, and allows up to eight devices on the same bus with the SMBus overtemperature alert function. The programmable temperature limits and the ALERT pin allow the sensor to operate as a stand-alone thermostat, or an overtemperature alarm for power throttling or system shutdown. The factory-calibrated temperature accuracy and the noise-immune digital interface make the TMP75B-Q1 the preferred solution for temperature compensation of other sensors and electronic components. The TMP75B-Q1 is designed for thermal management and protection of a variety of automotive applications, and is a high-performance alternative to a PCB-mounted thermistor.
기술 자료
설계 및 개발
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치