TPS7H4003-SEP
- Radiation performance:
- SEL, SEB, and SEGR immune up to LET = 43 MeV-cm2/mg
- SET and SEFI characterized up to LET = 43 MeV-cm2/mg
- TID assured for every wafer lot up to 50 krad(Si)
- Peak efficiency: 94% (VO = 1 V at 100 kHz)
- Integrated 17-mΩ and 9-mΩ MOSFETs
- Power rail: 3 V to 7 V on VIN
- Flexible switching frequency options:
- 100-kHz to 1-MHz adjustable internal oscillator
- External sync capability: 100kHz to 1MHz
- SYNC pins can be configured as 500-kHz clocks at 90° out of phase to parallel up to 4 devices
- 0.6-V ±1.7% voltage reference over temperature, radiation, and line and load regulation
- Monotonic start-up into prebiased outputs
- Adjustable slope compensation and soft-start
- Adjustable input enable and power-good output for power sequencing
- 44-pin PowerPAD™ HTSSOP package
- Space Enhanced Plastic:
- Controlled baseline
- Au bondwire and NiPdAu lead finish
- Enhanced mold compound for low outgassing
- One fabrication, assembly, and test site
- Extended product life cycle
- Extended product change notification
- Product traceability
The TPS7H4003-SEP is a radiation-tolerant, 7-V, 18-A synchronous buck converter with integrated low-resistance high-side and low-side MOSFETs in a thermally enhanced 34-pin ceramic flatpack package. High efficiency and reduced component count are achieved through current mode control.
The output voltage start-up ramp is controlled by the SS/TR pin which allows operation as either a stand alone power supply or in tracking situations. Power sequencing is possible by correctly configuring the enable and the power good pins. The TPS7H4003-SEP can be configured in primary-secondary mode and with the SYNC2 pin, four devices can be configured in parallel without an external clock.
Cycle-by-cycle current limiting on the high-side FET protects the device in overload situations and is enhanced by a low-side sourcing current protection which prevents current runaway. There is also a low-side sinking current protection which turns off the low-side MOSFET to prevent excessive reverse current. Thermal shutdown disables the part when die temperature exceeds thermal limit.
관심 가지실만한 유사 제품
비교 대상 장치와 유사한 기능
기술 자료
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
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패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
HTSSOP (DDW) | 44 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치