전원 관리 DC/DC 전력 모듈 벅 모듈(통합 인덕터)

TPSM53604

활성

간단한 풋프린트를 지원하는 작은 5.5 x 5 x 4mm 개선된 HotRod™ QFN의 36V, 4A 스텝다운 전원 모듈

이 제품의 최신 버전이 있습니다

open-in-new 대안 비교
이 제품은 기존 고객을 위해 계속 제공됩니다. 새로운 설계는 대체 제품을 고려해야 합니다.
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TPSM63604 활성 36V 입력, 16V 출력, 4A 동기 스텝다운 DC-DC 전원 모듈 Wider output voltage range, improved optimization for performance and ultra-low EMI

제품 상세 정보

Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Buck, Inverting Buck-Boost, Synchronous Buck Type Module Iout (max) (A) 4 Vin (min) (V) 3.8 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 7 EMI features Low parasitic Hotrod packaging Features EMI Tested, Enable, Light Load Efficiency, Power good Control mode current mode Duty cycle (max) (%) 98
Rating Catalog Operating temperature range (°C) -40 to 125 TI functional safety category Functional Safety-Capable Topology Buck, Inverting Buck-Boost, Synchronous Buck Type Module Iout (max) (A) 4 Vin (min) (V) 3.8 Vin (max) (V) 36 Vout (min) (V) 1 Vout (max) (V) 7 EMI features Low parasitic Hotrod packaging Features EMI Tested, Enable, Light Load Efficiency, Power good Control mode current mode Duty cycle (max) (%) 98
B3QFN (RDA) 15 27.5 mm² 5.5 x 5
  • Functional Safety-Capable
  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
    • Low EMI: meets CISPR11 radiated emissions
    • Excellent thermal performance: up to 20 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design
  • Functional Safety-Capable
  • 5-mm × 5.5-mm × 4-mm Enhanced HotRod™ QFN package
    • Industry’s smallest 36-V, 4-A footprint: 85 mm2 solution size (single sided)
    • Low EMI: meets CISPR11 radiated emissions
    • Excellent thermal performance: up to 20 W output power at 85°C, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • Input voltage range: 3.8 V to 36 V
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603 and 2-A TPSM53602
  • Create a custom design using the TPSM53604 with the WEBENCH Power Designer
  • Download the EVM Design Files for fast board design

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.

The TPSM53604 power module is a highly integrated 4-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53604 an excellent device for powering a wide range of applications.

다운로드 스크립트와 함께 비디오 보기 동영상

관심 가지실만한 유사 제품

open-in-new 대안 비교
다른 핀 출력을 지원하지만 비교 대상 장치와 동일한 기능
TPSM63603 활성 고밀도, 3V~36V 입력, 1V~16V 출력, 3A 전원 모듈 Lower output current and improved performance.
TPSM63606 활성 5mm x 5.5mm 향상된 HotRod™ QFN의 고밀도 36V 입력, 1V~16V 출력, 6A 전원 모듈 Greater output current and improved performance.

기술 자료

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

TPSM53604EVM — 3.8V~36V 입력, 4A 전원 모듈 평가 보드

The TPSM53604 evaluation board (EVM) is configured to evaluate the operation of the TPSM53604 power module for current up to 4 A. The input voltage range is 3.8 V to 36 V. The output voltage range is 1 V to 7 V. The evaluation board makes it easy to evaluate the TPSM53604 operation.
사용 설명서: PDF
TI.com에서 구매 불가
시뮬레이션 모델

TPSM53604 PSpice Transient Model

SNVMC56.ZIP (387 KB) - PSpice Model
설계 툴

SNVR482 TPSM53604 EVM Design Files

지원되는 제품 및 하드웨어

지원되는 제품 및 하드웨어

제품
벅 모듈(통합 인덕터)
TPSM53604 간단한 풋프린트를 지원하는 작은 5.5 x 5 x 4mm 개선된 HotRod™ QFN의 36V, 4A 스텝다운 전원 모듈
패키지 CAD 기호, 풋프린트 및 3D 모델
B3QFN (RDA) 15 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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동영상