CSD95373BQ5M
- 45-A Continuous Operating Current Capability
- 92.7% System Efficiency at 25 A
- Low-Power Loss of 2.6 W at 25 A
- High-Frequency Operation (up to 1.25 MHz)
- Diode Emulation Mode With FCCM
- Temperature Compensated Bi-Directional Current Sense
- Analog Temperature Output (600 mV at 0°C)
- Fault Monitoring
- High-Side Short, Overcurrent, and Overtemperature Protection
- 3.3-V and 5-V PWM Signal Compatible
- Tri-State PWM Input
- Integrated Bootstrap Diode
- Optimized Dead Time for Shoot-Through Protection
- High-Density SON 5-mm × 6-mm Footprint
- Ultra-Low-Inductance Package
- System Optimized PCB Footprint
- RoHS Compliant – Lead-Free Terminal Plating
- Halogen Free
The CSD95373BQ5M NexFET™ smart power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
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檢視所有 1 | 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | CSD95373BQ5M Synchronous Buck NexFET Smart Power Stage datasheet (Rev. A) | PDF | HTML | 2017年 7月 12日 |
設計與開發
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參考設計
PMP10393 — 搭載 PMBus 介面的高密度 600mV 200 A 五至六相 DC-DC 降壓轉換器參考設計
Advanced DCAP+ control is used to provide the high speed dynamic control needed for CPU, Memory and ASIC applications. Up to six high current synchronous power stages provide the high currents and low losses needed for these applications. Multi-phase also allows output ripple cancellation and (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| LSON-CLIP (DQP) | 12 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點