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CSD97374Q4M

現行

30V 25A SON 3.5 x 4.5mm 同步降壓 NexFET™ 功率級

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產品規格表

CSD97374Q4M

現行
產品規格表 立即訂購

產品詳細資料

VDS (V) 30 Ploss current (A) 15 Rating Catalog Operating temperature range (°C) -40 to 150
VDS (V) 30 Ploss current (A) 15 Rating Catalog Operating temperature range (°C) -40 to 150
VSON-CLIP (DPC) 8 15.75 mm² 4.5 x 3.5
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.5-mm × 4.5-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free
  • Over 92% System Efficiency at 15 A
  • Max Rated Continuous Current 25 A, Peak 60 A
  • High-Frequency Operation (up to 2 MHz)
  • High-Density SON 3.5-mm × 4.5-mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3-V and 5-V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Shoot-Through Protection
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen Free

The CSD97374Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97374Q4M NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high-current, high-efficiency, and high-speed switching device in a small 3.5-mm × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.
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類型 標題 日期
* Data sheet CSD97374Q4M Synchronous Buck NexFET™ Power Stage datasheet (Rev. D) PDF | HTML 2016年 8月 15日

設計與開發

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模擬型號

CSD97374CQ4M PSpice Transient Model

SLPM063.ZIP (39 KB) - PSpice Model
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模擬型號

CSD97374CQ4M TINA-TI Spice Transient Model

SLPM108.TSM (47 KB) - TINA-TI Spice Model
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參考設計

TIDA-00507 — 適用於微伺服器之 Intel Atom C2000 SoC VCCP 和 VNN 軌的高功率密度 9 至 15V 參考設計

The TI TPS53625 VR12 reference design (TIDA-00507), supporting Intel® Atom™ C2000, uses TI's driverless PWM architecture with TI power stages for high power density, high efficiency, and low component count while meeting Intel voltage tolerance requirements with low ripple and high (...)
Test report: PDF
電路圖: PDF
參考設計

TIDA-00572 — 適用於工業電腦的高功率密度 9V-15V 輸入 Intel® Pentium™ N3700 VCC0+VCC1 設計

The TI TPS1623 VR12.1 reference design, supporting Intel® Pentium™ N3700 , uses TI's driverless PWM architecture with TI power stages for high power density, high efficiency, and low component count  while meeting Intel voltage tolerance requirements with low ripple, tight loadline, (...)
Test report: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VSON-CLIP (DPC) 8 Ultra Librarian
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訂購與品質

內含資訊：
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊：
  • 晶圓廠位置
  • 組裝地點

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