HD3SS3411-Q1
- Q100 automotive qualified
- Compatible with multiple interface standards including FPD link, LVDS, PCIE Gen II, III, XAUI, and USB3.1
- Operates up to 10Gbps
- Wide –3dB differential BW of approximately 7.5GHz
- Excellent dynamic characteristics (at 4GHz)
- Insertion loss = –1.1dB
- Return loss = –11.3dB
- Off isolation = –19dB
- Bidirectional Mux/De-Mux differential switch
- Supports common-mode voltage 0V to 2V
- Single supply voltage VCC of 3.3V ±10%
- Industrial temperature range of –40°C to 105°C
The HD3SS3411-Q1 is a high-speed bi-directional passive switch in multiplexer or demultiplexer configurations. Based on control pin SEL, the device provides switching of differential channels between Port B to Port A or Port C to Port A.
The HD3SS3411-Q1 is a generic analog differential passive switch that can work for any high speed interface application as long as it is biased at a common-mode voltage range of 0V to 2V and has differential signaling with differential amplitude up to 1800mVpp. The device offers adaptive tracking that allows users to keep the channel unchanged for the entire common-mode voltage range.
Excellent dynamic characteristics of the device allow high speed switching with minimum attenuation to the signal eye diagram with little added jitter. The HD3SS3411-Q1 consumes < 2mW of power when operational and has a shutdown mode exercisable by OEn pin resulting < 2µW.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | HD3SS3411-Q1 One Channel Differential 2:1 Mux/Demux datasheet (Rev. B) | PDF | HTML | 2024年 3月 28日 |
EVM User's guide | HD3SS3411 EVM User's Guide | 2015年 6月 16日 |
設計與開發
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The HD3SS3411 is a high speed passive switch capable of switching differential channels between Port A to Ports B or C based on the state of control pin SEL. The interface to the EVM consists of standard SMP connectors to interface the EVM to test equipment or adapter boards to use in a (...)
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訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。