LM65645-Q1
- AEC-Q100 qualified for automotive applications:
- Temperature grade 1: –40°C to +125°C, TA
- Wide input voltage range: 3V to 65V
- Designed for low EMI requirements
- Facilitates CISPR 25 class 5 compliance
- Mode pin configurable ±5% or ±10% dual-random spread spectrum reducing peak emissions
- Enhanced HotRod™ QFN package with symmetrical pinout
- Switching frequency from 300kHz to 2.2MHz
- Pin-configurable 400kHz and 2.2MHz
- Pin-configurable AUTO or FPWM operation
- Low minimum on time: 40ns (maximum)
- Enables 36V to 3.3V conversion at 2.2MHz
- High-efficiency power conversion at all loads
- > 94% peak efficiency at 24VIN, 5VOUT, 400kHz
- 2.5µA PFM no-load input current
- High power density
- Internal compensation, current limit, and TSD
- 3.6mm × 2.6mm, wettable flank, 20-pin package
- ϴJA = 25.5°C/W (LM65645-Q1EVM)
- Create a custom design using the LM656x5-Q1 with the WEBENCH Power Designer
The LM656x5-Q1 are a family of automotive buck converters designed for high efficiency, high power density, and ultra-low electromagnetic interference (EMI). The converters operate over a wide input voltage range of 3V to 65V (70V tolerant) reducing the need for external input surge protection. The LM656x5-Q1 comes with pin selectable fixed output voltages of 3.3V and 5V or in adjustable configuration. The low EMI operation is enabled with minimized loop inductance and optimized switch node slew rate. A pin-selectable ±5% or ±10% dual-random spread spectrum (DRSS) significantly reduces peak emissions through a combination of triangular and pseudo-random modulation while keeping output voltage ripple very low. The current-mode control architecture with a 30ns typical minimum on-time allows high conversion ratios at high frequencies coupled with a fast transient response and excellent load and line regulation.
技術文件
設計與開發
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LM65645EVM — LM65645 評估模組
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN-FCRLF (RZT) | 20 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點