LMZ30602

現行

採用 9x11x2.8mm QFN 封裝的 2.95V 至 6V、2A 降壓電源模組

現在提供此產品的更新版本

open-in-new 比較替代產品
功能相同,但引腳輸出與所比較的裝置不同
TPSM82822 現行 具有整合式電感器、採用 2 x 2.5 x 1.1 mm μSIP 封裝的 5.5V 輸入、2A 降壓模組 Newer solution with smaller BOM size, lower Iq, higher voltage accuracy

產品詳細資料

Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 2 Vin (min) (V) 2.95 Vin (max) (V) 6 Vout (min) (V) 0.8 Vout (max) (V) 3.6 Switching frequency (min) (kHz) 500 Switching frequency (max) (kHz) 2000 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Control mode Voltage mode Duty cycle (max) (%) 91
Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 2 Vin (min) (V) 2.95 Vin (max) (V) 6 Vout (min) (V) 0.8 Vout (max) (V) 3.6 Switching frequency (min) (kHz) 500 Switching frequency (max) (kHz) 2000 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Control mode Voltage mode Duty cycle (max) (%) 91
B1QFN (RKG) 39 99 mm² 11 x 9
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9 mm × 11 mm × 2.8 mm package
    - Pin Compatible with LMZ30604 and LMZ30606
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30602 With the WEBENCH® Power Designer
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9 mm × 11 mm × 2.8 mm package
    - Pin Compatible with LMZ30604 and LMZ30606
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30602 With the WEBENCH® Power Designer

The LMZ30602 power module is an easy-to-use integrated power solution that combines a 2-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 2-A rated output current at 85°C ambient temperature without airflow.

The LMZ30602 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The LMZ30602 power module is an easy-to-use integrated power solution that combines a 2-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 2-A rated output current at 85°C ambient temperature without airflow.

The LMZ30602 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 7
類型 標題 日期
* Data sheet LMZ30602 2-A Power Module With 2.95V-6V Input in QFN Package datasheet (Rev. B) 2018年 4月 11日
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. D) 2021年 10月 14日
Application note Soldering Requirements for BQFN Packages (Rev. C) 2020年 3月 5日
White paper Simplify low EMI design with power modules 2017年 11月 20日
Application note Working With QFN Power Modules (Rev. A) 2017年 6月 8日
EVM User's guide Using the LMZ30606EVM-003, LMZ30604EVM-001, LMZ30602EVM-002 (Rev. A) 2014年 3月 6日
Application note Adjusting LMZ3 Output Voltage with LM10010/1 2014年 2月 11日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LMZ30606EVM-003 — 2.95V 至 6V、6A 降壓式電源模組評估板

The LMZ30606EVM-003 is a fully assembled and tested circuit for evaluating the LMZ30606. The output voltage can be selected from four preset values using a jumper (3.3V, 2.5V, 1.8V, 1.2V, and 0.8V) and has an adjustable switching frequency of 500 kHz to 1 MHz. Solder pads and jumpers are available (...)
使用指南: PDF
TI.com 無法提供
模擬型號

LMZ30602 PSpice Transient Model

SNVM516.ZIP (101 KB) - PSpice Model
模擬型號

LMZ30602 Unencrypted PSpice Transient Model

SNVM792.ZIP (7 KB) - PSpice Model
參考設計

TIDA-010011 — 用於保護繼電器處理器模組的高效電源供應架構參考設計

This reference design showcases various power architectures for generating multiple voltage rails for an application processor module, requiring >1A load current and high efficiency . The required power supply is generated using 5-, 12- or 24-V DC input from the backplane. Power supplies are (...)
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
B1QFN (RKG) 39 Ultra Librarian

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片