LMZ30602
- Complete Integrated Power Solution Allows
Small Footprint, Low-Profile Design - 9 mm × 11 mm × 2.8 mm package
- Pin Compatible with LMZ30604 and LMZ30606 - Efficiencies Up To 96%
- Wide-Output Voltage Adjust
0.8 V to 3.6 V, with ±1% Reference Accuracy - Adjustable Switching Frequency
(500 kHz to 2 MHz) - Synchronizes to an External Clock
- Adjustable Slow-Start
- Output Voltage Sequencing / Tracking
- Power Good Output
- Programmable Undervoltage Lockout (UVLO)
- Output Overcurrent Protection
- Over Temperature Protection
- Operating Temperature Range: –40°C to 85°C
- Enhanced Thermal Performance: 12°C/W
- Meets EN55022 Class B Emissions
- Integrated Shielded Inductor - Create a Custom Design Using the LMZ30602 With the WEBENCH® Power Designer
The LMZ30602 power module is an easy-to-use integrated power solution that combines a 2-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.
The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 2-A rated output current at 85°C ambient temperature without airflow.
The LMZ30602 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMZ30602 2-A Power Module With 2.95V-6V Input in QFN Package datasheet (Rev. B) | 2018年 4月 11日 | |
Selection guide | Innovative DC/DC Power Modules Selection Guide (Rev. D) | 2021年 10月 14日 | ||
Application note | Soldering Requirements for BQFN Packages (Rev. C) | 2020年 3月 5日 | ||
White paper | Simplify low EMI design with power modules | 2017年 11月 20日 | ||
Application note | Working With QFN Power Modules (Rev. A) | 2017年 6月 8日 | ||
EVM User's guide | Using the LMZ30606EVM-003, LMZ30604EVM-001, LMZ30602EVM-002 (Rev. A) | 2014年 3月 6日 | ||
Application note | Adjusting LMZ3 Output Voltage with LM10010/1 | 2014年 2月 11日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
LMZ30606EVM-003 — 2.95V 至 6V、6A 降壓式電源模組評估板
TIDA-010011 — 用於保護繼電器處理器模組的高效電源供應架構參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
B1QFN (RKG) | 39 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點