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電源模組 (整合式電感器)

LMZ30604

現行

採用 9x11x2.8mm QFN 封裝的 2.95V 至 6V、4A 降壓電源模組

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產品規格表

現在提供此產品的更新版本

open-in-new 比較替代產品
功能相同，但引腳輸出與所比較的裝置不同
TPSM82810 現行 2.75-V 至 6-V、4-A 降壓模組，採用 3 x 4 mm μSIP 封裝，具有可調整頻率和追蹤功能 Newer solution with smaller BOM size, higher efficiency, higher voltage accuracy
功能與所比較的裝置相似
TPSM82864A 現行 採用 3.5-mm x 4-mm QFN 封裝，且具有整合式電感器的 2.4-V 至 5.5-V 輸入、4-A 薄型降壓電源模組 Smaller total BOM size of 35 mm² (saves >80% area) and 4-µA IQ

LMZ30604

現行
產品規格表 立即訂購

產品詳細資料

Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 4 Vin (min) (V) 2.95 Vin (max) (V) 6 Vout (min) (V) 0.8 Vout (max) (V) 3.6 Switching frequency (min) (kHz) 500 Switching frequency (max) (kHz) 2000 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Control mode Voltage mode Duty cycle (max) (%) 91
Rating Catalog Operating temperature range (°C) -40 to 85 Topology Buck, Synchronous Buck Type Module Iout (max) (A) 4 Vin (min) (V) 2.95 Vin (max) (V) 6 Vout (min) (V) 0.8 Vout (max) (V) 3.6 Switching frequency (min) (kHz) 500 Switching frequency (max) (kHz) 2000 Features EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking Control mode Voltage mode Duty cycle (max) (%) 91
B1QFN (RKG) 39 99 mm² 11 x 9
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9 mm × 11 mm × 2.8 mm package
    - Pin Compatible with LMZ30602 and LMZ30606
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30604 With the WEBENCH® Power Designer
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9 mm × 11 mm × 2.8 mm package
    - Pin Compatible with LMZ30602 and LMZ30606
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    0.8 V to 3.6 V, with ±1% Reference Accuracy
  • Adjustable Switching Frequency
    (500 kHz to 2 MHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing / Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Operating Temperature Range: –40°C to 85°C
  • Enhanced Thermal Performance: 12°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ30604 With the WEBENCH® Power Designer

The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.

The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The LMZ30604 power module is an easy-to-use integrated power solution that combines a 4-A DC/DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×11×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 4-A rated output current at 85°C ambient temperature without airflow.

The LMZ30604 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
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類型 標題 日期
* Data sheet LMZ30604 4-A Power Module With 2.95V-6V Input in QFN Package datasheet (Rev. B) 2018年 4月 11日
Application note Soldering Considerations for Power Modules (Rev. C) PDF | HTML 2024年 3月 14日
Selection guide Innovative DC/DC Power Modules Selection Guide (Rev. D) 2021年 10月 14日
Application note Introduction to HVDC Architecture and Solutions for Control and Protection (Rev. B) PDF | HTML 2021年 9月 7日
Application note Soldering Requirements for BQFN Packages (Rev. C) 2020年 3月 5日
White paper Simplify low EMI design with power modules 2017年 11月 20日
Application note Working With QFN Power Modules (Rev. A) 2017年 6月 8日
Application note How to Configure LMZ30604 Power Module with Ceramic Capacitor (Rev. A) 2016年 11月 1日
EVM User's guide Using the LMZ30606EVM-003, LMZ30604EVM-001, LMZ30602EVM-002 (Rev. A) 2014年 3月 6日
Application note Adjusting LMZ3 Output Voltage with LM10010/1 2014年 2月 11日

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LMZ30606EVM-003 — 2.95V 至 6V、6A 降壓式電源模組評估板

The LMZ30606EVM-003 is a fully assembled and tested circuit for evaluating the LMZ30606. The output voltage can be selected from four preset values using a jumper (3.3V, 2.5V, 1.8V, 1.2V, and 0.8V) and has an adjustable switching frequency of 500 kHz to 1 MHz. Solder pads and jumpers are available (...)
使用指南: PDF
TI.com 無法提供
模擬型號

LMZ30604 PSpice Transient Model

SNVM539.ZIP (133 KB) - PSpice Model
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模擬型號

LMZ30604 Unencrypted PSpice Transient Model

SNVM793.ZIP (7 KB) - PSpice Model
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參考設計

TIDA-010011 — 用於保護繼電器處理器模組的高效電源供應架構參考設計

此參考設計展示各種電源架構，可為需要 >1A 負載電流和高效率的應用處理器模組產生多重電壓軌。所需的電源是使用來自背板的 5、12 或 24-V DC 輸入所產生。電源供應器是使用配備整合式 FET 的 DC-DC 轉換器，以及具尺寸整合式電感器的電源模組所產生。此設計採用 HotRod™ 封裝類型，適合需要低 EMI 的應用。此外也最適合設計時間有限的應用。其他功能包括 DDR 終端穩壓器、輸入電源 OR-ing、電壓序列、用於過載保護的 eFuse，以及電壓和負載電流監控。此設計可搭配處理器、數位訊號處理器以及現場可編程邏輯閘陣列使用。已通過輻射發射測試，符合 A 類和 B 要求的 (...)
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
B1QFN (RKG) 39 Ultra Librarian
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