SN55HVD75-EP
- Bus I/O Protection
- >±15-kV HBM Protection
- >±12-kV IEC 61000-4-2 Contact Discharge
- >±4-kV IEC 61000-4-4 Fast Transient Burst
- Extended Industrial Temperature Range –55°C to 125°C
- Large Receiver Hysteresis (80 mV) for Noise Rejection
- Low-Unit-Loading Allows Over 200 Connected Nodes
- Low-Power Consumption
- Low-Standby Supply Current: < 2 µA
- ICC < 1-mA Quiescent During Operation
- 5-V Tolerant Logic Inputs Compatible With 3.3-V or 5-V Controllers
- Signaling Rate Options Optimized for: 250 kbps, 20 Mbps, 50 Mbps
- Available in a Small VSON Package
- Supports Defense, Aerospace, and Medical Applications:
- Controlled Baseline
- One Assembly/Test Site
- One Fabrication Site
- Available in Extended (–55°C to 125°C) Temperature Range
- Extended Product Life Cycle
- Extended Product-Change Notification
- Product Traceability
These devices have robust 3.3-V drivers and receivers in a small package for demanding industrial applications. The bus pins are robust to ESD events with high levels of protection to human-body model and IEC contact discharge specifications.
Each of these devices combines a differential driver and a differential receiver which operate from a single 3.3-V power supply. The driver differential outputs and the receiver differential inputs are connected internally to form a bus port suitable for half-duplex (two-wire bus) communication. These devices feature a wide common-mode voltage range making the devices suitable for multi-point applications over long cable runs. These devices are characterized from –55°C to 125°C.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | SN55HVD75-EP 3.3-V Supply RS-485 With IEC ESD Protection datasheet (Rev. A) | PDF | HTML | 2017年 2月 6日 |
* | Radiation & reliability report | SN55HVD75DRBREP Reliability Report | 2016年 2月 16日 |
設計與開發
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
VSON (DRB) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。