THVD8000
- 3-V – 5.5-V supply voltage
- Half-duplex communication
- Up to 500 kbps data rate with f0 / bps = 10
- Higher data rates are possible with f0 / bps < 10
- RS-485 electrical signaling with on-off keying (OOK) modulation
- Pin selectable carrier frequency: 125 kHz – 5 MHz
- Spread spectrum clocking for excellent EMI performance
- Polarity free
- TX timeout to avoid stuck bus conditions
- Operational common-mode range: –7 V to 12 V
- Bus I/O protection
- ± 18-V DC fault protection
- ± 16 kV HBM ESD
- ± 8 kV IEC 61000-4-2 contact discharge
- ± 15 kV IEC 61000-4-2 air gap discharge
- ± 4 kV IEC 61000-4-4 fast transient burst
- Extended temperature range: -40°C to 125°C
- 8-Pin SOT-23 package for space constrained applications
THVD8000 is an RS-485 transceiver with on-off keying (OOK) modulation and demodulation built in for power line communication. Modulating data onto existing power lines allows power delivery and data communication to share a common pair of wires, resulting in a significant reduction of the system cost.
A pin programmable interface simplifies the system design. The carrier frequency can be adjusted by changing an external resistor on the F_SET pin. A broad range of carrier frequencies gives the system designer the flexibility to choose the external inductors and capacitors. In addition, OOK modulation operates with immunity to data polarity for ease of system installations.
技術文件
設計與開發
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PLC010935BP — PLC010935BP BoosterPack™ 插入式模組,用於太陽能電力線通訊參考設計
PLC010935BP BoosterPack™ 插入式模組是 TIDA-010935 參考設計的可訂購版本。 這個 BoosterPack 插入式模組與適用於 80-MHz Arm® Cortex®-M0+ MCU 的 MSPM0G3507 LaunchPad™ 開發套件配合使用,可使用 UART 至 PLC THVD8000 和 THS6222 線路驅動器實現電力線通信 (PLC)。 探索 THS6222 裝置失真性能和輸出驅動、THVD8000 開/關鍵控調變以及 Arm Cortex-M0+ MCU 硬體和軟體功能的優勢,從而為各種應用啟用 PLC。
THVD8000EVM — 具有 RS-485 過電源匯流排功能的 THVD8000 評估模組
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
TIDA-010935 — 太陽能電源線通訊參考設計
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23-THN (DDF) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。