TLV733P-Q1
- AEC-Q100 qualified for automotive applications:
- Temperature grade 1: –40°C to 125°C, TA
- Device junction temperature range: –40°C to 150°C
- Input voltage range: 1.4 V to 5.5 V
- Stable operation with or without capacitors
- Foldback overcurrent protection
- Package:
- 2.0-mm × 2.0-mm WSON-6
- 2.9-mm × 1.6-mm SOT-23
- Very low dropout: 125 mV at 300 mA (3.3 VOUT)
- Accuracy: 1% typical, 1.4% maximum
- Low IQ: 34 µA
- Available in fixed-output voltages: 1.0 V to 3.3 V
- High PSRR: 50 dB at 1 kHz
- Active output discharge
The TLV733P-Q1 family of low dropout (LDO) linear regulators are ultra-small, low quiescent current LDOs that can source 300 mA with good line and load transient performance. These devices provide a typical accuracy of 1%.
The TLV733P-Q1 family is designed with a modern capacitor-free architecture to ensure stability without an input or output capacitor. The removal of the output capacitor allows for a very small solution size, and can eliminate inrush current at startup. Furthermore, the TLV733P-Q1 family is also stable with ceramic output capacitors if an output capacitor is necessary. The TLV733P-Q1 family also provides foldback current control during device power-up and enabling if an output capacitor is used. This functionality is especially important in battery-operated devices.
The TLV733P-Q1 family provides an active pulldown circuit to quickly discharge output loads when disabled.
The TLV733P-Q1 family is available in the 6-pin DRV (WSON) and 5-pin DBV (SOT-23) packages.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TLV733P-Q1 Capacitor-Free, 300-mA, Low Dropout (LDO) Linear Regulator datasheet (Rev. F) | PDF | HTML | 2020年 10月 15日 |
| User guide | Power Supply Design for Renesas R-Car M3 (Rev. A) | 2021年 10月 29日 | ||
| Functional safety information | TLV733P-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA (Rev. A) | PDF | HTML | 2020年 9月 14日 | |
| Technical article | Adding CAN nodes in Bluetooth® Low Energy PEPS systems | PDF | HTML | 2019年 6月 11日 |
設計與開發
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| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOT-23 (DBV) | 5 | Ultra Librarian |
| WSON (DRV) | 6 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。