TMP9R00-SP
- QMLV Qualified: 5962R2021401VXC
- Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
- Single Event Latchup (SEL) Immune to 76 MeV·cm2 /mg at 125°C
- Thermally Enhanced 16-Lead Ceramic HKT Package
- 8-Channel Remote Diode Temperature Sensor Accuracy: ±1.5°C
- Local Temperature Sensor Accuracy: ±1.5°C
- Temperature Resolution: 0.0625°C
- Logic Voltage Range: 1.7 V to 3.6 V
- Supply Range: 1.7 V to 2.0 V
- 67 µA Operating Current (1 SPS, All Channels Active)
- 0.3 µA Shutdown Current
- Remote Diode: Series Resistance Cancellation, η-Factor Correction, Offset Correction, and Diode Fault Detection
- Register Lock Function Secures Key Registers
- I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address
The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring solution.
Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.
The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 2.0 V), common two-wire interfaces (1.7 V to 3.6 V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.
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TMP9R01EVM — TMP9R01 evaluation module
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
CFP (HKT) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點