TPS2375
- Fully Supports IEEE 802.3af Specification
- Integrated 0.58-Ω, 100-V, Low-Side Switch
- 15-kV System Level ESD Capable
- Supports Use of Low-Cost Silicon Rectifiers
- Programmable Inrush Current Control
- Fixed 450-mA Current Limit
- Fixed and Adjustable UVLO Options
- Open-Drain, Power-Good Reporting
- Overtemperature Protection
- Industrial Temperature Range: –40°C to 85°C
- 8-Pin SOIC and TSSOP Packages
- APPLICATIONS
- VoIP Phones
- WLAN Access Points
- Security Cameras
- Internet Appliances
- POS Terminals
These easy-to-use 8-pin integrated circuits contain all of the features needed to develop an IEEE 802.3af compliant powered device (PD). The TPS2375 family is a second generation PDC (PD Controller) featuring 100-V ratings and a true open-drain, power-good function.
In addition to the basic functions of detection, classification and undervoltage lockout (UVLO), these controllers include an adjustable inrush limiting feature. The TPS2375 has 802.3af compliant UVLO limits, the TPS2377 has legacy UVLO limits, and the TPS2376 has a programmable UVLO with a dedicated input pin.
The TPS2375 family specifications incorporate a voltage offset of 1.5 V between its limits and the IEEE 802.3af specifications to accommodate the required input diode bridges used to make the PD polarity insensitive.
Additional resources can be found on the TI Web site www.ti.com.
技術文件
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
TPS2375EVM — TPS2375 IEEE802.3af POE 供電裝置評估模組
The HPA028 EVM features the TPS2375 from Texas Instruments Incorporated. The EVM is designed to look like the front end of any Power Over Ethernet (PoE) Powered Device (PD) module. An RJ-45 connector is provided to connect directly to an Ethernet cable having a Power Sourcing Equipment (PSE) (...)
TPS2375OR77CALC — TPS2375/TPS2377 Design-in Calculation Tool
支援產品和硬體
產品
供電產品
硬體開發
開發板
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
TSSOP (PW) | 8 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。