TPS65197
- 8-Channel Level-Shifter (STV, RESET, 6 × CLK)
- High Output-Voltage Level 16.5 V to 45 V (VGH)
- Low Output-Voltage Level Down to –20 V (VGL)
- Selectable Charge-Sharing
- No Charge-Sharing
- 2-Channel Charge-Sharing
- 3-Channel Charge-Sharing
- 2-Channel Panel Discharge
- T-CON Failure Detection
- TPS65197: Logic Resets by STV Pulse
- TPS65197B: No Reset of the Logic
- Latched Shut-Down Detection (Clocks to VGH)
- Supports 100-kHz Clock Operating Frequency
- 28-Pin 4-mm × 4-mm QFN Package
The TPS65197/B is an 8-channel level-shifter with discharge function intended for use in LCD display applications such as Notebooks, Monitors and TVs.
The device converts the timing-controller (T-CON) logic-level signals to the high-level signals needed by the gate-in-panel (GIP) display.
The clock outputs, CLKOUTx, support normal level shifting operation and 2-channel or 3-channel charge-sharing, which can be used to improve picture quality and power consumption. At power down, all outputs follow their input signals as long as possible; when the discharge function is used, the outputs are pulled high (VGH).
The TPS65197 implements a logic reset to ignore wrong T-CON signals after the rising STV edge which forces all 6 output clocks to VGL1. The next CLKIN1 rising edge unlocks the logic and enables normal operation. The TPS65197B does not have the logic reset and always follows its input signals.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TPS65197x: 8-Channel Level-Shifter Supporting No, 2-Channel and 3-Channel Charge-Sharing with Panel Discharge to VGH during Shut-Down datasheet (Rev. D) | PDF | HTML | 2018年 2月 12日 |
Application note | Understanding Undervoltage Lockout in Power Devices (Rev. A) | 2018年 9月 19日 | ||
Selection guide | Power Management Guide 2018 (Rev. R) | 2018年 6月 25日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RUY) | 28 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。