TPSM81033
- Input voltage range: 1.8V to 5.5V
- Output voltage range: 2.2V to 5.5V
- FB connected to VIN for fixed 5.0V output
- 5.5A valley switching current limit
- Integreted 0.50µH (at 0A) power inductor
- Excellent thermal performance:
- < 30°C temperature rise at VIN = 3.6V, VOUT = 5V, IOUT = 2A, and TA=25C
- High efficiency and high power capability
- Two 25mΩ (LS) / 46mΩ (HS) MOSFETs
- > 90% efficiency at VIN = 3.6V, VOUT = 5V, and IOUT = 2A
- 2.4MHz switching frequency
- Typical 20µA quiescent current into VIN pin
- Typical 0.1µA shutdown current
- ±1.5% Reference voltage accuracy over –40°C to +125°C
- Power good output with window comparator
- Pin-selectable auto PFM or forced PWM at light load
- Pass-through mode when VIN > VOUT
- Safety and robust operation features
- True disconnection between input and output during shutdown
- Output overvoltage, thermal shutdown protection and output short-circuit protection
- 2.6mm × 2.5mm QFN-FCMOD 9-Pin package
The TPSM81033 is a synchronous boost module. The device provides a power supply solution for portable equipment and smart devices powered by batteries and other power supply. The TPSM81033 has 5.5A (typical) valley switch current limit. The power module uses TI’s MagPack packaging technology to integrate a synchronous boost converter and an inductor to simplify design, reduce external components, and save PCB area.
The TPSM81033 uses adaptive constant on-time valley-current-control topology to regulate the output voltage and operates at 2.4MHz switching frequency. There are two optional modes at light load by configuring the MODE pin: auto PFM mode and forced PWM to balance the efficiency and noise immunity in light load. The TPSM81033 consumes a 20µA quiescent current from VIN at light load condition. During shutdown, the TPSM81033 is completely disconnected from the input power and only consumes a 0.1µA current to achieve long battery life. The TPSM81033 has 5.75V output overvoltage protection, output short circuit protection, and thermal shutdown protection. The TPSM81033 offers a very small solution size with 2.6mm × 2.5mm QFN-FCMOD (9) package and minimum amount of external components.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | TPSM81033 5.5V, 5.5A, 2.4MHz, Synchronous Boost Power Module with MagPack Packaging Technology, Power Good Indicator and Output Discharge Function datasheet (Rev. C) | PDF | HTML | 2024年 9月 9日 |
| EVM User's guide | TPSM81033EVM-035 Evaluation Module User's Guide (Rev. A) | PDF | HTML | 2024年 11月 7日 | |
| Technical article | 電源模組封裝類型及其優勢 | PDF | HTML | 2024年 8月 12日 | |
| Technical article | MagPack™ 技術：全新電源模組的四大優勢，助您以更少空間 封裝更多功率 | PDF | HTML | 2024年 8月 5日 |
設計與開發
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TPSM81033EVM-035 — TPSM81033 評估模組
TPSM81033EVM-035 設計用於提供快速設定，以評估輸出電壓設定為 5V 的 TPSM81033 裝置。
TPSM81033 是同步升壓模組。本裝置提供電源供應設計，適用於由各種電池和他種電源供應供電的可攜式設備和智慧裝置。TPSM81033 在完整溫度範圍中具備 5.5A (典型值) 波谷切換電流限制。
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| QFN-FCMOD (VCD) | 9 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點