The SN55LVDS31 is a differential line driver that implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. This driver will deliver a minimum differential output voltage magnitude of 247 mV into a 100-Ω load when enabled.
The intended application of this device and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 Ω. The transmission media may be printed-circuit board traces, backplanes, or cables. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.
The SN55LVDS31 is characterized for operation from –55°C to 125°C.
| Typ | Titel | Datum | ||
|---|---|---|---|---|
| * | Data sheet | High-Speed Differential Line Driver - SN55LVDS31-SP datasheet | 01 Mär 2012 | |
| * | SMD | SN55LVDS31-SP SMD 5962-97621 | 08 Jul 2016 | |
| * | Radiation & reliability report | SN55LVDS31 and SN55LVDS32 SEE Report | 31 Mär 2015 | |
| * | Radiation & reliability report | SN55LVDS31J Radiation Test Report | 31 Mär 2015 | |
| Application brief | DLA Approved Optimizations for QML Products (Rev. B) | PDF | HTML | 23 Okt 2024 | |
| Selection guide | TI Space Products (Rev. J) | 12 Feb 2024 | ||
| More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) | 31 Aug 2023 | ||
| Application note | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) | PDF | HTML | 17 Nov 2022 | |
| Application note | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 19 Okt 2022 | |
| Application brief | Space-Grade, 100-krad, Isolated Serial Peripheral Interface (SPI) LVDS Circuit | PDF | HTML | 29 Jun 2021 | |
| E-book | Radiation Handbook for Electronics (Rev. A) | 21 Mai 2019 |
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| Gehäuse | Pins | CAD-Symbole, Footprints und 3D-Modelle |
|---|---|---|
| CFP (W) | 16 | Ultra Librarian |
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